Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints

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	Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints
	Q. K. Zhang; H. F. Zou; Z. F. Zhang
	2009
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	38 期号:6 页码:852-859
摘要	Tensile properties and stress-controlled fatigue fracture behaviors of Cu/Sn-4Ag solder joints aged at 180A degrees C for different times were systematically investigated. It was found that the tensile strength of the solder joints decreased with increasing aging time and that the fracture mode changed from ductile to brittle. The fatigue life of the solder joints also decreased with increasing aging time. For most of the solder joints, fatigue cracks tended to initiate around the Cu/Cu(6)Sn(5) interfaces due to the strain incompatibility and local strain concentration on a micro-scale, and they then propagated within the solder proximately along the Cu/Cu(6)Sn(5) interfaces. The samples aged fora different pound times or tested under different stress amplitudes had similar fractography morphologies, which consisted mainly of a propagation region, covered by solder, and a final fracture region. Based on the experimental observations above, the corresponding interfacial fatigue failure mechanisms were discussed in terms of different influencing factors.
部门归属	[zhang, q. k.; zou, h. f.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, qk (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Lead-free Solders Interface Intermetallic Compounds (Imcs) Fatigue Crack Fractography Intermetallic Compound Deformation-behavior Cu Microstructure Evolution Growth 96.5sn-3.5ag Temperature Interfaces Morphology
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WOS记录号	WOS:000267031600021
引用统计	被引频次：25[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32562
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. K. Zhang,H. F. Zou,Z. F. Zhang. Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints[J]. Journal of Electronic Materials,2009,38(6):852-859.
APA	Q. K. Zhang,H. F. Zou,&Z. F. Zhang.(2009).Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints.Journal of Electronic Materials,38(6),852-859.
MLA	Q. K. Zhang,et al."Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints".Journal of Electronic Materials 38.6(2009):852-859.