| Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition | |
| X. F. Zhang; J. D. Guo; J. K. Shang | |
| 2009 | |
| Source Publication | Journal of Alloys and Compounds
 |
| ISSN | 0925-8388 |
| Volume | 479Issue:1-2Pages:505-510 |
| Abstract | Effects of Zn addition on the interfacial reaction between Sn and Ni(P) were investigated by systematically varying the Zn concentration in the Sn solder. It was found that the typical Ni-Sn reaction product, Ni(3)Sn(4) phase, was changed substantially by adding small amounts of Zn to the Sn. With the Zn addition, the ternary Ni(4)(Sn(1-x)Zn(x)) phase formed at the interface during reflow and aging according to X-ray diffraction analysis. In the Ni(4)(Sn(1-x)Zn(x)) phase, the lattice parameters contracted with increasing Zn content, in agreement with the Vegard's law. Since diffusions of the reactive species through the denser ternary intermetallic compound were more unlikely than through the binary Ni(3)Sn(4), the Zn-containing solder showed a much slower electroless Ni-P consumption rate than Sn. The decrease in Ni consumption rate increased with the increasing Zn content in Sn. The reason for the decrease was that the growth rate of Ni(4)(Sn(1-x)Zn(x)) phase was directly determined by substitution of Zn atoms into the Sn sublattice. (C) 2009 Published by Elsevier B.V. |
| description.department | [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa. [zhang, x. f.; guo, j. d.; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;shang, jk (reprint author), univ illinois, dept mat sci & engn, 1304 w green st, urbana, il 61801 usa;jkshang@uiuc.edu |
| Keyword | Intermetallic Compound Electroless Ni-p Interfacial Reaction Zn Addition Tin Lead-free Solders Interfacial Reactions Cu Substrate Metallization Joints Reliability Growth Microstructure Packages Alloys |
| URL | 查看原文 |
| WOS ID | WOS:000267063300114 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/32576 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | X. F. Zhang,J. D. Guo,J. K. Shang. Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition[J]. Journal of Alloys and Compounds,2009,479(1-2):505-510. |
| APA | X. F. Zhang,J. D. Guo,&J. K. Shang.(2009).Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition.Journal of Alloys and Compounds,479(1-2),505-510. |
| MLA | X. F. Zhang,et al."Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition".Journal of Alloys and Compounds 479.1-2(2009):505-510. |
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