A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction

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	A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction
	H. F. Zou; H. J. Yang; Z. F. Zhang
	2009
发表期刊	Journal of Applied Physics
ISSN	0021-8979
卷号	106 期号:11
摘要	The wetting reaction between molten Sn and (011) Cu single crystal was investigated. Based on the electron backscattered diffraction technique, the preferential orientation relationships between the scallop-type Cu(6)Sn(5) grains and (011) Cu single crystals were detected. The strong texture of Cu(6)Sn(5) grains was formed on the normal direction although the Sn/(011) Cu couple was aged at 170 degrees C for 40 days. This indicates that the Cu(6)Sn(5) grains do not desultorily form on the (011) Cu substrate for these scallop-type Cu(6)Sn(5) grains.
部门归属	[zou, h. f.; yang, h. j.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zou, hf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;hfzou@imr.ac.cn zhfzhang@imr.ac.cn
关键词	Ageing Copper Copper Alloys Electron Backscattering Electron Diffraction Texture Tin Alloys Wetting Lead-free Solders Interfacial Reactions Single-crystal Molten Sn Growth Joints
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32642
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zou,H. J. Yang,Z. F. Zhang. A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction[J]. Journal of Applied Physics,2009,106(11).
APA	H. F. Zou,H. J. Yang,&Z. F. Zhang.(2009).A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction.Journal of Applied Physics,106(11).
MLA	H. F. Zou,et al."A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction".Journal of Applied Physics 106.11(2009).