| Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate | |
| H. F. Zou; Q. K. Zhang; Z. F. Zhang | |
| 2009 | |
| Source Publication | Scripta Materialia
 |
| ISSN | 1359-6462 |
| Volume | 61Issue:3Pages:308-311 |
| Abstract | The segregation of Bi at the Cu/Cu(3)Sn interfaces of the SnBi/Cu couple dramatically decreases this couple's mechanical properties. Here, we deliberately add Ag, Al, Sn and Zn elements into the Cu substrate to eliminate the interfacial segregation and embittlement of the SnBi/Cu couple. Experimental results confirmed that there is always a perfect Cu(3)Sn/Cu alloy interface without Bi segregation, and excellent mechanical properties are thus maintained. The most important finding is that the interfacial embrittlement of SnBi/Cu alloy joints was successfully eliminated even after prolonged aging. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| description.department | [zou, h. f.; zhang, q. k.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn |
| Keyword | Bi Interfacial Segregation Embrittlement Pb-free Solder Interfacial Strength Soldering Copper Grain-boundaries Fracture Boron Chemistry Ni3al |
| URL | 查看原文 |
| WOS ID | WOS:000266788200021 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/32643 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | H. F. Zou,Q. K. Zhang,Z. F. Zhang. Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate[J]. Scripta Materialia,2009,61(3):308-311. |
| APA | H. F. Zou,Q. K. Zhang,&Z. F. Zhang.(2009).Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate.Scripta Materialia,61(3),308-311. |
| MLA | H. F. Zou,et al."Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate".Scripta Materialia 61.3(2009):308-311. |
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