| Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate |
| H. F. Zou; Z. F. Zhang
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| 2009
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| 发表期刊 | Journal of Alloys and Compounds
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| ISSN | 0925-8388
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| 卷号 | 469期号:1-2页码:207-214 |
| 摘要 | Growth kinetics and interfacial morphologies of the intermetallic compounds (IMCs) between single crystal Ag and Sn-4Ag, Sn-3Cu and Sn-37Pb solders were investigated by solid-state aging at 160 degrees C and liquid-state aging at 260 degrees C. Isothermal equation of chemical reaction and phase diagrams were used to explain the effects of Ag, Cu and Pb on the growth kinetics of IMCs under solid-state and liquid-state aging conditions. The diffusion coefficients for the three solder joints of Sn-4Ag/Ag, Sn-3Cu/Ag and Sn-37Pb/Ag were calculated after solid-state and liquid-state aging. It is found that Pb can effectively retard the growth of IMCs during liquid-state aging but has little influence on the growth rate of IMCs during the solid-state aging. Some local small cracks were frequently observed in the Cu(6)Sn(5) particles near interfaces of the Sn-3Cu/Ag solder joints after solid-state aging for several days. However, there were no such local small cracks when solders or interfaces did not contain the Cu(6)Sn(5) particles after the same aging time. (C) 2008 Elsevier B.V. All rights reserved. |
| 部门归属 | [zou, h. f.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
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| 关键词 | Ag Single Crystal Substrate
Lead-free Solder
Intermetallic Compounds
(Imcs)
Growth Kinetics
Local Cracks
Lead-free Solders
Electroless Ni(p) Metallization
Intermetallic
Compound
Cu-sn
Joints
Ni
Bi
Nanoindentation
Microstructure
Wt.percent
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| URL | 查看原文
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| WOS记录号 | WOS:000263801500037
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| 引用统计 |
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| 文献类型 | 期刊论文
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| 条目标识符 | http://ir.imr.ac.cn/handle/321006/32644
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| 专题 | 中国科学院金属研究所
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推荐引用方式
GB/T 7714 |
H. F. Zou,Z. F. Zhang. Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate[J]. Journal of Alloys and Compounds,2009,469(1-2):207-214.
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| APA |
H. F. Zou,&Z. F. Zhang.(2009).Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate.Journal of Alloys and Compounds,469(1-2),207-214.
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| MLA |
H. F. Zou,et al."Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate".Journal of Alloys and Compounds 469.1-2(2009):207-214.
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