Microstructural stability of a single crystal superalloy DD8 during thermal exposure

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	Microstructural stability of a single crystal superalloy DD8 during thermal exposure
	K. Y. Cheng; D. H. Kim; Y. S. Yoo; C. Y. Jo; T. Jin; Z. Q. Hu
	2008
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	24 期号:1 页码:127-130
摘要	Microstructural stability of a nickel base single crystal alloy DD8 has been investigated. Standard heat treated specimen showed good microstructural stability at 950 degrees C. While under the as-cast condition, a kind of rod-like phase precipitated in the interdendritic region of as-cast specimen during thermal exposure. The phase, which has bcc structure, was enriched with Cr. Thermo-calc also predicted precipitation of a bcc phase at around 950 degrees C. The Cr-rich bcc phase was considered as alpha-Cr and formed due to the segregation of Cr under the as-cast condition.
部门归属	[kim, d. h.] kims, mat test & characterizat grp, chang won, south korea. [cheng, k. y.; jin, t.; hu, z. q.] chinese acad sci, inst met res, superalloy div, shenyang 110016, peoples r china. [cheng, k. y.; yoo, y. s.; jo, c. y.] kims, high temp mat grp, chang won, south korea.;kim, dh (reprint author), kims, mat test & characterizat grp, chang won, south korea;kdhl644@kims.re.kr
关键词	Dd-8 Single Crystal Alloy Microstructural Stability Alpha Chromium Nickel-base Superalloy Fatigue
URL	查看原文
WOS记录号	WOS:000253208300032
引用统计	被引频次：3[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32688
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	K. Y. Cheng,D. H. Kim,Y. S. Yoo,et al. Microstructural stability of a single crystal superalloy DD8 during thermal exposure[J]. Journal of Materials Science & Technology,2008,24(1):127-130.
APA	K. Y. Cheng,D. H. Kim,Y. S. Yoo,C. Y. Jo,T. Jin,&Z. Q. Hu.(2008).Microstructural stability of a single crystal superalloy DD8 during thermal exposure.Journal of Materials Science & Technology,24(1),127-130.
MLA	K. Y. Cheng,et al."Microstructural stability of a single crystal superalloy DD8 during thermal exposure".Journal of Materials Science & Technology 24.1(2008):127-130.