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Effect of cooling rate on solidification microstructures in AISI 304 stainless steel
J. W. Fu; Y. S. Yang; J. J. Guo; W. H. Tong
2008
发表期刊Materials Science and Technology
ISSN0961-5652
卷号24期号:8页码:941-944
摘要AISI 304 austenitic stainless steel was cast into a water cooled copper mould with wedge shaped slot to investigate the effect of cooling rates on its microstructural evolution and solidification sequences between delta ferrite and austenite phases. Dendritic delta ferrite forms at the base of the sample where the cooling rate is low. With increasing cooling rate, the solidification mode is transformed from primary ferrite mode to primary austenite mode resulted from the phase selection. The metastable austenite solidifies as the primary phase due to its kinetic advantage when the growth rate is sufficiently high. With the higher cooling rate at the tip of the sample, the morphology of the austenite phase transforms from dendritic to cellular.
部门归属[fu, j. w.; yang, y. s.; tong, w. h.] chinese acad sci, inst met res, shenyang 110016, peoples r china. [fu, j. w.; guo, j. j.] harbin inst technol, sch mat sci & engn, harbin 150001, peoples r china.;yang, ys (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china;ysyang@imr.ac.cn
关键词Stainless Steel Microstructural Evolution Phase Selection Austenitic Stainless-steel Phase-formation Weld Metal Alloy Transformation Stability Cracking
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WOS记录号WOS:000259795800011
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被引频次:87[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/32764
专题中国科学院金属研究所
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J. W. Fu,Y. S. Yang,J. J. Guo,et al. Effect of cooling rate on solidification microstructures in AISI 304 stainless steel[J]. Materials Science and Technology,2008,24(8):941-944.
APA J. W. Fu,Y. S. Yang,J. J. Guo,&W. H. Tong.(2008).Effect of cooling rate on solidification microstructures in AISI 304 stainless steel.Materials Science and Technology,24(8),941-944.
MLA J. W. Fu,et al."Effect of cooling rate on solidification microstructures in AISI 304 stainless steel".Materials Science and Technology 24.8(2008):941-944.
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