Material removal and surface damage in EDM of Ti3SiC2 ceramic

IMR OpenIR

	Material removal and surface damage in EDM of Ti3SiC2 ceramic
	C. F. Hu; Y. C. Zhou; Y. W. Bao
	2008
发表期刊	Ceramics International
ISSN	0272-8842
卷号	34 期号:3 页码:537-541
摘要	Material removal and surface damage of Ti3SiC2 ceramic during electrical discharge machining (EDM) were investigated. Melting and decomposition were found to be the main material removal mechanisms during the machining process. Material removal rate was enhanced acceleratively with increasing discharge current, i(e), working voltage, u(i), but increased deceleratively with pulse duration, t(e). Microcracks in the surface and loose grains in the subsurface resulted from thermal shock were confirmed, and the surface damage in Ti3SiC2 ceramic led to a degradation of both strength and reliability. (C) 2007 Elsevier Ltd and Techna Group S.r.l. All rights reserved.
部门归属	[hu, c. f.; zhou, y. c.; bao, y. w.] chinese acad sci, inst met sci, shenyang natl lab mat sci, high performance ceram div, shenyang 110016, peoples r china. [bao, y. w.] china bldg mat acad, beijing 100024, peoples r china.;zhou, yc (reprint author), chinese acad sci, inst met sci, shenyang natl lab mat sci, high performance ceram div, 72 wenhua rd, shenyang 110016, peoples r china;yczhou@imr.ac.cn
关键词	Surfaces Strength Ti3sic2 Electrical Discharge Machining Discharge Machining Process Theoretical-models Contact Damage Erosion Model Microstructure Deformation Oxidation Composite Strength Behavior
URL	查看原文
WOS记录号	WOS:000254698300013
引用统计	被引频次：31[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32817
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	C. F. Hu,Y. C. Zhou,Y. W. Bao. Material removal and surface damage in EDM of Ti3SiC2 ceramic[J]. Ceramics International,2008,34(3):537-541.
APA	C. F. Hu,Y. C. Zhou,&Y. W. Bao.(2008).Material removal and surface damage in EDM of Ti3SiC2 ceramic.Ceramics International,34(3),537-541.
MLA	C. F. Hu,et al."Material removal and surface damage in EDM of Ti3SiC2 ceramic".Ceramics International 34.3(2008):537-541.