Investigation of the pitting of aluminum induced by chloride ions by holographic microphotography | |
L. Li; C. Wang; S. H. Chen; X. M. Hou; X. G. Yang | |
2008 | |
发表期刊 | Journal of the Serbian Chemical Society
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ISSN | 0352-5139 |
卷号 | 73期号:5页码:561-568 |
摘要 | Holographic microphotography was used to investigate the dynamic processes of pitting during anodic dissolution of aluminum in a solution containing chloride ions. The induction and the follow-up propagation processes of the pitting were observed in real-time. A simple model of the propagating process of the pitting was deduced from the result of the holograms of the Al/electrolyte interface. The results prove that holographic microphotography is a useful tool to study the dynamic processes of pitting. |
部门归属 | [li, liang; wang, chao] xuzhou normal univ, dept chem, xuzhou 221009, peoples r china. [chen, shenhao; hou, xianmin; yang, xuegeng] shandong univ, dept chem, jinan 250100, peoples r china. [wang, chao; chen, shenhao] state key lab corros & protect, shenyang 110016, peoples r china.;wang, c (reprint author), xuzhou normal univ, dept chem, xuzhou 221009, peoples r china;wangc@xznu.edu.cn |
关键词 | Holography Pitting Aluminum Chloride Ions Magnetic-field Anodic-dissolution Digital Holography Corrosion Iron Metals Interferometry Sulfate Anions Acid |
URL | 查看原文 |
WOS记录号 | WOS:000256267900007 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/32878 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | L. Li,C. Wang,S. H. Chen,et al. Investigation of the pitting of aluminum induced by chloride ions by holographic microphotography[J]. Journal of the Serbian Chemical Society,2008,73(5):561-568. |
APA | L. Li,C. Wang,S. H. Chen,X. M. Hou,&X. G. Yang.(2008).Investigation of the pitting of aluminum induced by chloride ions by holographic microphotography.Journal of the Serbian Chemical Society,73(5),561-568. |
MLA | L. Li,et al."Investigation of the pitting of aluminum induced by chloride ions by holographic microphotography".Journal of the Serbian Chemical Society 73.5(2008):561-568. |
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