Fabrication of a gradient nano-micro-structured surface layer on bulk copper by means of a surface mechanical grinding treatment

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	Fabrication of a gradient nano-micro-structured surface layer on bulk copper by means of a surface mechanical grinding treatment
	W. L. Li; N. R. Tao; K. Lu
	2008
发表期刊	Scripta Materialia
ISSN	1359-6462
卷号	59 期号:5 页码:546-549
摘要	By using a novel surface nanocrystallization technique, surface mechanical grinding treatment at cryogenic temperatures, we synthesized a gradient nano-micro-structure in the surface layer of bulk pure copper. The average grain sizes vary from about 22 nm in the topmost surface to sub-micrometers at about 200 mu m deep, corresponding to a gradient change in hardness from 2.1 to 1.1 GPa in the coarse-grained matrix. (c) 2008 Published by Elsevier Ltd. on behalf of Acta Materialia Inc.
部门归属	[li, w. l.; tao, n. r.; lu, k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, liaoning, peoples r china.;tao, nr (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, liaoning, peoples r china;nrtao@imr.ac.cn
关键词	Nanocrystalline Materials Surface Mechanical Grinding Treatment (Smgt) Gradient Nano-micro-structure Copper Severe Plastic-deformation Metallic Materials Evolution Strain Microstructure Refinement
URL	查看原文
WOS记录号	WOS:000258165100018
引用统计	被引频次：354[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32897
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	W. L. Li,N. R. Tao,K. Lu. Fabrication of a gradient nano-micro-structured surface layer on bulk copper by means of a surface mechanical grinding treatment[J]. Scripta Materialia,2008,59(5):546-549.
APA	W. L. Li,N. R. Tao,&K. Lu.(2008).Fabrication of a gradient nano-micro-structured surface layer on bulk copper by means of a surface mechanical grinding treatment.Scripta Materialia,59(5),546-549.
MLA	W. L. Li,et al."Fabrication of a gradient nano-micro-structured surface layer on bulk copper by means of a surface mechanical grinding treatment".Scripta Materialia 59.5(2008):546-549.