Influence of electric current on Kirkendall diffusion of Zn/Cu couples

IMR OpenIR

	Influence of electric current on Kirkendall diffusion of Zn/Cu couples
	Y. J. Li; Y. S. Yang; X. H. Feng
	2008
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	24 期号:3 页码:410-414
摘要	The influence of electric current on Kirkendall diffusion in Zn/Cu couples was investigated. Under the action of different electric currents, the Zn/Cu diffusion couples were annealed at 785 degrees C for different holding time. The experimental results show that the displacement of the Kirkendall plane increases with increasing holding time. However, the displacement of the Kirkendall plane with electric current is larger than that without electric current. The relationship between the displacement of the Kirkendall plane and the holding time is changed under the action of electric current. The likely reason for the electric current enhancing effect is the energy transfer from electron to jumping atom, increasing the integrated diffusion coefficient, which leads to the increase in the velocity of Kirkendall plane.
部门归属	[li, yingju; yang, yuansheng; feng, xiaohui] chinese acad sci, inst met res, shenyang 110016, peoples r china.;yang, ys (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china;ysyang@imr.ac.cn
关键词	Electric Current Electromigration Kirkendall Effect Darken Equations Electromigration Superalloys Failure Metals Phase Field
URL	查看原文
WOS记录号	WOS:000256449900030
引用统计	被引频次：14[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32906
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Y. J. Li,Y. S. Yang,X. H. Feng. Influence of electric current on Kirkendall diffusion of Zn/Cu couples[J]. Journal of Materials Science & Technology,2008,24(3):410-414.
APA	Y. J. Li,Y. S. Yang,&X. H. Feng.(2008).Influence of electric current on Kirkendall diffusion of Zn/Cu couples.Journal of Materials Science & Technology,24(3),410-414.
MLA	Y. J. Li,et al."Influence of electric current on Kirkendall diffusion of Zn/Cu couples".Journal of Materials Science & Technology 24.3(2008):410-414.