Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures

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	Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures
	Y. S. Li; N. R. Tao; K. Lu
	2008
发表期刊	Acta Materialia
ISSN	1359-6454
卷号	56 期号:2 页码:230-241
摘要	The microstructural evolution and formation mechanism of nanostructures in bulk pure Cu samples induced by dynamic plastic deformation (DPD) at high strain rates and cryogenic temperatures were investigated using transmission electron microscopic characterization. Three different mechanisms were identified for the plastic deformation and microstructural refinement, including dislocation manipulation and rearrangement, deformation twinning forming nanoscale twin/matrix (T/M) lamellae in bundles, and shear banding in the T/M lamellae. An increasing tendency of deformation twinning and shear banding was observed at higher strains. For strain epsilon=2.1, a mixed nanostructure is formed in the DPD Cu bulk sample with nanoscale T/M lamellae making up about 33% of the volume and nano-sized grains making up about 67%. The nanograins can be classified into three types in terms of their origin: (i) nanograins derived from fragmentation of nanoscale T/M lamellae with an average transverse size of about 47 nm; (ii) nanograins in shear bands with an average transverse size of about 75 nm, and (iii) nanograins derived from dislocation cells with an average transverse size of about 121 nm. The high density of deformation twins induced by high strain rates and cryogenic temperatures in DPD, distinct from that in conventional severe plastic deformation, plays a crucial role in formation of the nano-sized grains. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[li, y. s.; tao, n. r.; lu, k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;tao, nr (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;nrtao@imr.ac.cn lu@imr.ac.cn
关键词	Nanostructured Materials Copper Dynamic Plastic Deformation Deformation Twinning Shear Banding Mechanical Attrition Treatment Grain-refinement Shear Bands Single-crystals Large Strains Metals Cu Recrystallization Strength Nickel
URL	查看原文
WOS记录号	WOS:000252686100008
引用统计	被引频次：567[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32908
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Y. S. Li,N. R. Tao,K. Lu. Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures[J]. Acta Materialia,2008,56(2):230-241.
APA	Y. S. Li,N. R. Tao,&K. Lu.(2008).Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures.Acta Materialia,56(2),230-241.
MLA	Y. S. Li,et al."Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures".Acta Materialia 56.2(2008):230-241.