Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation

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	Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation
	Y. S. Li; Y. Zhang; N. R. Tao; K. Lu
	2008
发表期刊	Scripta Materialia
ISSN	1359-6462
卷号	59 期号:4 页码:475-478
摘要	Thermal annealing of a nanostructured Cu sample processed by means of dynamic plastic deformation (DPD) induces static recrystallization (SRX) accompanied by a drop in strength and enhanced ductility. An obvious increment in tensile uniform elongation appears when the volume fraction of SRX grains exceeds 80%. The strength-ductility combination of the annealed nanostructured samples is superior to that of strain-induced ultrafine-grained Cu, owing to the finer grains and the presence of nanoscale twin bundles generated from the DPD. (c) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[li, y. s.; zhang, y.; tao, n. r.; lu, k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;tao, nr (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;nrtao@imr.ac.cn
关键词	Nanostructure Copper Annealing Mechanical Properties Dynamic Plastic Deformation (Dpd) Nano-scale Twins Ductility Strength Metals Iron
URL	查看原文
WOS记录号	WOS:000257615700027
引用统计	被引频次：140[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32909
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Y. S. Li,Y. Zhang,N. R. Tao,et al. Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation[J]. Scripta Materialia,2008,59(4):475-478.
APA	Y. S. Li,Y. Zhang,N. R. Tao,&K. Lu.(2008).Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation.Scripta Materialia,59(4),475-478.
MLA	Y. S. Li,et al."Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation".Scripta Materialia 59.4(2008):475-478.