Effect of transient liquid phase (TLP) bonding on the ductility of a Ni-base single crystal superalloy in a stress rupture test

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	Effect of transient liquid phase (TLP) bonding on the ductility of a Ni-base single crystal superalloy in a stress rupture test
	J. D. Liu; T. Jin; N. R. Zhao; Z. H. Wang; X. F. Sun; H. R. Guan; Z. Q. Hu
	2008
发表期刊	Materials Characterization
ISSN	1044-5803
卷号	59 期号:1 页码:68-73
摘要	A Ni-base single crystal superalloy was transient liquid phase (TLP) bonded using a Ni-Cr-B amorphous foil at 1230 degrees C for 8 h. Stress rupture tests of the TLP joint and a matrix sample were carried out at 982 degrees C/248 MPa and 1010 degrees C/248 MPa. The microstructures and fracture surfaces were studied using scanning electron microscopy (SEM). Transmission electron microscopy (TEM) investigations were performed after creep rupture testing to examine the deformation substructures. The results show that the stress rupture ductility of TLP joints is significantly decreased compared to the matrix sample. This reduction of the ductility of TLP joints can be attributed to solid solution strengthening by boron atoms, subgrain boundaries formed in the bonding zone and the concentration of creep cavities formed during the last stage of the stress rupture test. (c) 2006 Elsevier Inc. All rights reserved.
部门归属	[liu, j. d.; jin, t.; zhao, n. r.; wang, z. h.; sun, x. f.; guan, h. r.; hu, z. q.] chinese acad sci, inst met res, dept superalloys, shenyang 110016, peoples r china. [liu, j. d.] chinese acad sci, grad sch, beijing 100039, peoples r china.;liu, jd (reprint author), chinese acad sci, inst met res, dept superalloys, 72 wenhua rd, shenyang 110016, peoples r china;jdliu@imr.ac.cn
关键词	Ni-based Single Crystal Superalloy Tlp Bonding Stress Rupture Properties Ductility Creep-behavior Interlayer Alloy Cast Alloy-718 Heat-treatment Microstructure Boron
URL	查看原文
WOS记录号	WOS:000252408300010
引用统计	被引频次：27[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32949
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	J. D. Liu,T. Jin,N. R. Zhao,et al. Effect of transient liquid phase (TLP) bonding on the ductility of a Ni-base single crystal superalloy in a stress rupture test[J]. Materials Characterization,2008,59(1):68-73.
APA	J. D. Liu.,T. Jin.,N. R. Zhao.,Z. H. Wang.,X. F. Sun.,...&Z. Q. Hu.(2008).Effect of transient liquid phase (TLP) bonding on the ductility of a Ni-base single crystal superalloy in a stress rupture test.Materials Characterization,59(1),68-73.
MLA	J. D. Liu,et al."Effect of transient liquid phase (TLP) bonding on the ductility of a Ni-base single crystal superalloy in a stress rupture test".Materials Characterization 59.1(2008):68-73.