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The effect of twin plane spacing on the deformation of copper containing a high density of growth twins
Z. W. Shan; L. Lu; A. M. Minor; E. A. Stach; S. X. Mao
2008
发表期刊Jom
ISSN1047-4838
卷号60期号:9页码:71-74
摘要In-situ tensile straining in a transmission electron microscope was used to investigate the role of twin plane spacing on the deformation and fracture mechanism of pure copper containing a high densin: of nanoscale growth twins. Real-time and post-mortem observations clearly reveal that twin plane spacing plays a key role in determining the operative deformation mechanism and therefore the subsequent crack propagation path. The deformation mechanism transition, which results front changes in the twin plane spacing, has implications for interpreting the unusual mechanical behavior of the copper with a high density of nanoscale growth twins.
部门归属[shan, z. w.; minor, a. m.] lawrence berkeley natl lab, natl ctr electron microscopy, berkeley, ca 94720 usa. [shan, z. w.; mao, s. x.] univ pittsburgh, dept mech engn, pittsburgh, pa 15260 usa. [minor, a. m.] univ calif berkeley, dept mat sci, berkeley, ca 94720 usa. [lu, l.] chinese acad sci, inst met res, shenyang, peoples r china. [stach, e. a.] purdue univ, sch mat engn, w lafayette, in 47907 usa. [stach, e. a.] purdue univ, birck nanotechnol ctr, w lafayette, in 47907 usa.;shan, zw (reprint author), lawrence berkeley natl lab, natl ctr electron microscopy, berkeley, ca 94720 usa;zhiweishan@gmail.com
关键词Nano-scale Twins Nanocrystalline Nickel Rate Sensitivity Metals Boundaries Mechanism Al
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WOS记录号WOS:000259122300012
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被引频次:77[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/33064
专题中国科学院金属研究所
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Z. W. Shan,L. Lu,A. M. Minor,et al. The effect of twin plane spacing on the deformation of copper containing a high density of growth twins[J]. Jom,2008,60(9):71-74.
APA Z. W. Shan,L. Lu,A. M. Minor,E. A. Stach,&S. X. Mao.(2008).The effect of twin plane spacing on the deformation of copper containing a high density of growth twins.Jom,60(9),71-74.
MLA Z. W. Shan,et al."The effect of twin plane spacing on the deformation of copper containing a high density of growth twins".Jom 60.9(2008):71-74.
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