Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu

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	Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu
	P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
	2008
发表期刊	Scripta Materialia
ISSN	1359-6462
卷号	59 期号:3 页码:317-320
摘要	The growth mechanisms Of Cu(3)Sn at the interface between eutectic SnBi solder and Cu were investigated by transmission electron microscopy. On (100) Cu the interfacial reaction-during reflow resulted in a columnar growth Of Cu(3)Sn along Cu [100] with a special crystallographic relationship of (210)(Cu3Sn)parallel to(402)(Cu)parallel to and [122](Cu3Sn)parallel to[010](Cu). In the subsequent solid-state aging new triangular COri grains nucleated and grew at the triple junction sites of the interface between Cu and two adjacent COri grains. (c) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[shang, p. j.; liu, z. q.; li, d. x.; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;liu, zq (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;zqliu@imr.ac.cn
关键词	Cu(3)Sn Growth Interface Soldering Transmission Electron Microscopy (Tem) Lead-free Solders Diffusion Couples Snpb Bi Temperature Systems Joints Copper Phase
URL	查看原文
WOS记录号	WOS:000257651800015
引用统计	被引频次：34[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33065
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	P. J. Shang,Z. Q. Liu,D. X. Li,et al. Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu[J]. Scripta Materialia,2008,59(3):317-320.
APA	P. J. Shang,Z. Q. Liu,D. X. Li,&J. K. Shang.(2008).Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu.Scripta Materialia,59(3),317-320.
MLA	P. J. Shang,et al."Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu".Scripta Materialia 59.3(2008):317-320.