Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints

IMR OpenIR

	Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints
	P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
	2008
发表期刊	Scripta Materialia
ISSN	1359-6462
卷号	58 期号:5 页码:409-412
摘要	Transmission electron microscopy evidence was obtained to elucidate the mechanism for Bi-induced interfacial void formation in solder joints. After thermal aging, Bi segregated to the Cu3Sn/Cu to form fine particles on the interface in SnBi/Cu solder joints. Interfacial voids were found near the interfacial Bi particles. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[shang, p. j.; liu, z. q.; li, d. x.; shang, j. k.] chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;liu, zq (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china;zqliu@imr.ac.cn
关键词	Eutectic Snbi Alloy Soldering Interface Segregation Transmission Electron Microscopy (Tem) Lead-free Solders Sn-bi Segregation Cu Reliability Bismuth
URL	查看原文
WOS记录号	WOS:000253552700018
引用统计	被引频次：59[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33066
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	P. J. Shang,Z. Q. Liu,D. X. Li,et al. Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints[J]. Scripta Materialia,2008,58(5):409-412.
APA	P. J. Shang,Z. Q. Liu,D. X. Li,&J. K. Shang.(2008).Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints.Scripta Materialia,58(5),409-412.
MLA	P. J. Shang,et al."Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints".Scripta Materialia 58.5(2008):409-412.