Effects of strain, strain rate and temperature on deformation twinning in a Cu-Zn alloy

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	Effects of strain, strain rate and temperature on deformation twinning in a Cu-Zn alloy
	G. H. Xiao; N. R. Tao; K. Lu
	2008
发表期刊	Scripta Materialia
ISSN	1359-6462
卷号	59 期号:9 页码:975-978
摘要	The effects of strain, strain rate and temperature on deformation twinning in a Cu-Zn alloy were systematically investigated by means of transmission electron microscopy. With increasing strain, the average twin layer thickness (lambda) decreased slightly while the average twin boundary spacing (Delta) decreased significantly; both saturated at the same value when strain exceeds 1.2. Variations of lambda. with strain rate and temperature were analyzed by using the Zener-Hollomon parameter, Z, and it was found that a larger Z leads to a smaller lambda. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[xiao, g. h.; tao, n. r.; lu, k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;tao, nr (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, 72 wenhua rd, shenyang 110016, peoples r china;nrtao@imr.ac.cn
关键词	Nanoscale Deformation Twins Cu-zn Alloy Strain Strain Rated Temperature Dynamic Plastic-deformation Stacking-fault Energy Nano-scale Twins Microstructural Evolution Nanostructure Formation Mechanical Twins Pure Copper Nanoscale Strength Stress
URL	查看原文
WOS记录号	WOS:000259931700016
引用统计	被引频次：96[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33223
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	G. H. Xiao,N. R. Tao,K. Lu. Effects of strain, strain rate and temperature on deformation twinning in a Cu-Zn alloy[J]. Scripta Materialia,2008,59(9):975-978.
APA	G. H. Xiao,N. R. Tao,&K. Lu.(2008).Effects of strain, strain rate and temperature on deformation twinning in a Cu-Zn alloy.Scripta Materialia,59(9),975-978.
MLA	G. H. Xiao,et al."Effects of strain, strain rate and temperature on deformation twinning in a Cu-Zn alloy".Scripta Materialia 59.9(2008):975-978.