Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect

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	Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect
	X. F. Zhang; J. D. Guo; J. K. Shang
	2008
发表期刊	Journal of Materials Research
ISSN	0884-2914
卷号	23 期号:12 页码:3370-3378
摘要	Polarity effect on the interfacial reactions from high-density electric currents was investigated in a solder interconnect with a large disparity in the effective charge between the solder constituents. A reverse polarity effect was found where the intermetallic compound layer at the cathode grew significantly thicker than that at the anode under electric loading. Such an abnormal polarity effect was shown to result from electromigrations of Sn and Zn along opposite directions as dictated by the disparity in their effective charges. As Sn migrated to the anode under electron wind force, the resulting back stress drove Zn atoms to drift to the cathode. A kinetic analysis of the Zn mass transport explained the differential growth of the intermetallic compounds at the two electrodes, in good agreement with the experimental data.
部门归属	[zhang, x. f.; guo, j. d.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;shang, jk (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jkshang@uiuc.edu
关键词	Ni-p/au Layer Interfacial Reactions Cu Indium Films Tin
URL	查看原文
WOS记录号	WOS:000261432200033
引用统计	被引频次：21[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33346
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	X. F. Zhang,J. D. Guo,J. K. Shang. Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect[J]. Journal of Materials Research,2008,23(12):3370-3378.
APA	X. F. Zhang,J. D. Guo,&J. K. Shang.(2008).Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect.Journal of Materials Research,23(12),3370-3378.
MLA	X. F. Zhang,et al."Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect".Journal of Materials Research 23.12(2008):3370-3378.