Electroless plating of copper on AZ31 magnesium alloy substrates

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	Electroless plating of copper on AZ31 magnesium alloy substrates
	H. Zhao; Z. H. Huang; J. Z. Cui
	2008
发表期刊	Microelectronic Engineering
ISSN	0167-9317
卷号	85 期号:2 页码:253-258
摘要	Chemical surface preparation for copper film on magnesium alloy by both electroless plating and organic coatings was studied. Organic coating was made by immersing the samples into an organosilicon heat-resisting varnish. A subsequent metallization process verified the applicability of this method. In this method, the organic coating acted as an interlayer between the substrate and copper film. When the reaction started, copper deposited directly onto the interlayer surface. X-ray diffraction and SEM analysis were used to understand the composition and morphology of the interlayer and copper film. The copper film has a rather perfect crystalline structure. And the result of the cross-cut test indicates the adhesion between the substrate is good enough. The potentiodynamic polarization curves for corrosion studies of coated magnesium alloys were performed in a corrosive environment of 3.5 wt% NaCl at neutral pH 7. The result reveals that compared with the substrate, the corrosion resistance of the coated AZ31 magnesium alloys increases distinctly. Moreover, the copper film has perfectly antibacterial and decorative properties. The method proposed in this work is environmentally friendly: nontoxic chemicals are used. In addition, this provides a new concept for plating the metals, which are considered difficult to plate due to high reactivity. (c) 2007 Elsevier B.V. All rights reserved.
部门归属	[zhao, hui; cui, jianzhong] northeastern univ, minist educ, key lab electromagnet proc mat, shenyang 110004, peoples r china. [huang, zhanghong] chinese acad sci, inst met res, environm corros ctr, shenyang 110016, peoples r china.;cui, jz (reprint author), northeastern univ, minist educ, key lab electromagnet proc mat, shenyang 110004, peoples r china;jzcui@mail.neu.edu.cn
关键词	Organic Coatings Copper Film Electroless Plating Corrosion Corrosion Coatings Films Deposits Silver
URL	查看原文
WOS记录号	WOS:000253030300002
引用统计	被引频次：16[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33359
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. Zhao,Z. H. Huang,J. Z. Cui. Electroless plating of copper on AZ31 magnesium alloy substrates[J]. Microelectronic Engineering,2008,85(2):253-258.
APA	H. Zhao,Z. H. Huang,&J. Z. Cui.(2008).Electroless plating of copper on AZ31 magnesium alloy substrates.Microelectronic Engineering,85(2),253-258.
MLA	H. Zhao,et al."Electroless plating of copper on AZ31 magnesium alloy substrates".Microelectronic Engineering 85.2(2008):253-258.