Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film

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	Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film
	Q. S. Zhu; Z. F. Zhang; Z. G. Wang; J. K. Shang
	2008
发表期刊	Journal of Materials Research
ISSN	0884-2914
卷号	23 期号:1 页码:78-82
摘要	Electrodeposited Ag film was explored as a potential interfacial barrier to Bi segregation for suppressing the interfacial embrittlement of Cu/SnBi interconnects. The presence of Ag film introduced Ag3Sn intermetallic layer at the interface, which effectively prevented Bi from reaching the Cu/intermetallic interface. When the persistent slip bands (PSBs) in the Cu single crystal were driven to impinge the Cu/Cu3Sn interface, interfacial cracking was averted and instead superceded by cracking of intermetallic compounds (IMCs) at the interface.
部门归属	[zhu, q. s.; zhang, z. f.; wang, z. g.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn jkshang@imr.ac.cn
关键词	Copper Grain-boundaries Solder Joints Bismuth Segregation Cu Interconnect Growth
URL	查看原文
WOS记录号	WOS:000252291200011
引用统计	被引频次：26[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33410
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. S. Zhu,Z. F. Zhang,Z. G. Wang,et al. Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film[J]. Journal of Materials Research,2008,23(1):78-82.
APA	Q. S. Zhu,Z. F. Zhang,Z. G. Wang,&J. K. Shang.(2008).Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film.Journal of Materials Research,23(1),78-82.
MLA	Q. S. Zhu,et al."Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film".Journal of Materials Research 23.1(2008):78-82.