Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

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	Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals
	H. F. Zou; H. J. Yang; Z. F. Zhang
	2008
发表期刊	Acta Materialia
ISSN	1359-6454
卷号	56 期号:11 页码:2649-2662
摘要	The morphologies and orientation relationships of Cu6Sn5 grains formed between Sn and (001), (011), (111) and (123) Cu single crystals under liquid- and solid-state aging conditions were systematically investigated. The regular prism-type Cu6Sn5 grains formed on (001) and (111) Cu single crystals are elongated either along two perpendicular directions or along three preferential directions with an angle of 60 degrees between each pair of directions. The orientation relationships between Cu and Cu6Sn5 lattice structures were determined by electron backscatter diffraction and were explained in terms of their minimum misfit. However, on (011) and (123) Cu single crystal surfaces, the Cu6Sn5 grains were mainly scallop-type, with only a few regular prism-type grains. Furthermore, the regular prism-type Cu6Sn5 grains will change into scallop-type after long reflow or aging times. Meanwhile it is considered that the growth of the scallop-type grains is supplied by two fluxes: the flux of the interfacial reaction and the flux of ripening. However, the growth of the prism-type grains is only supplied by the flux of the interfacial reaction. The kinetics of IMCs growth between Sn and Cu single crystals was also investigated. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[zou, h. f.; yang, h. j.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Cu Single Crystal Orientation Intermetallic Compounds (Imcs) Coarsening Mechanism Growth Kinetics Lead-free Solders Interfacial Reactions Eutectic Snpb Joints Microstructure Sn-3.5ag Sn-0.7cu Copper
URL	查看原文
WOS记录号	WOS:000257367800026
引用统计	被引频次：181[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33418
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zou,H. J. Yang,Z. F. Zhang. Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals[J]. Acta Materialia,2008,56(11):2649-2662.
APA	H. F. Zou,H. J. Yang,&Z. F. Zhang.(2008).Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals.Acta Materialia,56(11),2649-2662.
MLA	H. F. Zou,et al."Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals".Acta Materialia 56.11(2008):2649-2662.