Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint

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	Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint
	H. F. Zou; Q. S. Zhu; Z. F. Zhang
	2008
发表期刊	Journal of Alloys and Compounds
ISSN	0925-8388
卷号	461 期号:1-2 页码:410-417
摘要	The growth kinetics and interfacial morphologies of intermetallic compounds (IMCs) and tensile properties of single crystal Ag/Sn-3.8Ag-0.7Cu (SAC) solder joint were investigated by solid-state aging at 170 degrees C and liquid-state aging at 250 degrees C. It is found that the growth kinetics of IMCs under both solid- and liquid-state aging conditions follow parabola relationship. Accordingly, the diffusion coefficients under the two conditions were calculated to be about 2.50 x 10(-17) m(2) s(-1) and 1.60 x 10(-14) m(2) s(-1), respectively. With increasing aging time, the scallop-like morphology of the IMC gradually evolved into planar type after solid-state aging; but it became rougher after liquid-state aging. Meanwhile, the average grain size of IMC also increases with increasing aging time. The tensile strength of the Sn-Ag-Cu/Ag single crystal joints did not decrease seriously with increasing aging time and the corresponding tensile fracture mechanism was discussed. (c) 2007 Elsevier B.V. All rights reserved.
部门归属	[zou, hefei; zhu, qingsheng; zhang, zhefeng] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Ag Single Crystal Substrate Sn-3.8ag-0.7cu Solder Intermetallic Compounds (Imcs) Growth Kinetics Tensile Strength Fracture Lead-free Solder Interfacial Reaction Cu-substrate Microstructure Metallization Sn-3.5ag Bump Ni Strength Pb
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WOS记录号	WOS:000258036500083
引用统计	被引频次：38[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33421
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zou,Q. S. Zhu,Z. F. Zhang. Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint[J]. Journal of Alloys and Compounds,2008,461(1-2):410-417.
APA	H. F. Zou,Q. S. Zhu,&Z. F. Zhang.(2008).Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint.Journal of Alloys and Compounds,461(1-2),410-417.
MLA	H. F. Zou,et al."Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint".Journal of Alloys and Compounds 461.1-2(2008):410-417.