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Work hardening of ultrafine-grained copper with nanoscale twins
X. H. Chen; L. Lu
2007
发表期刊Scripta Materialia
ISSN1359-6462
卷号57期号:2页码:133-136
摘要Work hardening behaviors of electrodeposited ultrafine-grained Cu with nanoscale growth twins are investigated by means of uniaxial continuous tensile and loading-unloading tests. A high density of nanoscale twins leads to a significant enhancement in flow strength and work hardening rate, while the work hardening coefficient (n) does not show any obvious variation with the twin density. These effects were analyzed in terms of the post-deformation microstructures. (C) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;lu, l (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;llu@imr.ac.cn
关键词Ultrafine-grained Copper Nanoscale Twins Work Hardening Rate Work Hardening Coefficient Nanocrystalline Copper Ultrahigh-strength Deformation Nickel Ductility Behavior Metals
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WOS记录号WOS:000247059800016
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被引频次:165[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/33460
专题中国科学院金属研究所
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X. H. Chen,L. Lu. Work hardening of ultrafine-grained copper with nanoscale twins[J]. Scripta Materialia,2007,57(2):133-136.
APA X. H. Chen,&L. Lu.(2007).Work hardening of ultrafine-grained copper with nanoscale twins.Scripta Materialia,57(2),133-136.
MLA X. H. Chen,et al."Work hardening of ultrafine-grained copper with nanoscale twins".Scripta Materialia 57.2(2007):133-136.
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