Degradation of solderability of electroless nickel by phosphide particles

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	Degradation of solderability of electroless nickel by phosphide particles; Degradation of solderability of electroless nickel by phosphide particles
	J. J. Guo; A. P. Man; J. K. Shang
	2007 ; 2007
发表期刊	Surface & Coatings Technology ; Surface & Coatings Technology
ISSN	0257-8972 ; 0257-8972
卷号	202 期号:2 页码:268-274
摘要	Wetting of electroless nickel by the eutectic SnAgCu solder alloy was investigated in the as-deposited and annealed conditions. In the as-deposited state, P content in the nickel had a minimal effect on the solderability of the electroless nickel. Upon annealing, numerous nickel phosphide particles precipitated out of the electroless nickel with a high-P content. The presence of these phosphide precipitates reduced the solderability of the electroless nickel both in terms of the wetting force and wetting kinetics. While weakening in the wetting force is related to the inferior contact condition, the slower wetting kinetics is explained in terms of the reduction in the dissolution rate of the electroless nickel from non-soluble phosphide particles. (c) 2007 Elsevier B.V. All rights reserved.; Wetting of electroless nickel by the eutectic SnAgCu solder alloy was investigated in the as-deposited and annealed conditions. In the as-deposited state, P content in the nickel had a minimal effect on the solderability of the electroless nickel. Upon annealing, numerous nickel phosphide particles precipitated out of the electroless nickel with a high-P content. The presence of these phosphide precipitates reduced the solderability of the electroless nickel both in terms of the wetting force and wetting kinetics. While weakening in the wetting force is related to the inferior contact condition, the slower wetting kinetics is explained in terms of the reduction in the dissolution rate of the electroless nickel from non-soluble phosphide particles. (c) 2007 Elsevier B.V. All rights reserved.
部门归属	univ illinois, dept mat sci & engn, urbana, il 61801 usa. chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;shang, jk (reprint author), univ illinois, dept mat sci & engn, urbana, il 61801 usa;jkshang@uiuc.edu ; univ illinois, dept mat sci & engn, urbana, il 61801 usa. chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;shang, jk (reprint author), univ illinois, dept mat sci & engn, urbana, il 61801 usa;jkshang@uiuc.edu
关键词	Solderability Solderability Electroless Nickel Electroless Nickel Wetting Wetting Pb-free Solder Pb-free Solder Snagcu Alloy Snagcu Alloy Lead-free Solders Lead-free Solders State Interfacial Reaction State Interfacial Reaction Ni-plated Kovar Ni-plated Kovar Ag-cu Ag-cu Solders Solders Intermetallic Compounds Intermetallic Compounds Mechanical-properties Mechanical-properties Bump Bump Metallization Metallization Microstructure Microstructure Copper Copper Wettability Wettability
URL	查看原文 ; 查看原文
WOS记录号	WOS:000251182600010 ; WOS:000251182600010
引用统计	被引频次：12[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33558
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	J. J. Guo,A. P. Man,J. K. Shang. Degradation of solderability of electroless nickel by phosphide particles, Degradation of solderability of electroless nickel by phosphide particles[J]. Surface & Coatings Technology, Surface & Coatings Technology,2007, 2007,202, 202(2):268-274, 268-274.
APA	J. J. Guo,A. P. Man,&J. K. Shang.(2007).Degradation of solderability of electroless nickel by phosphide particles.Surface & Coatings Technology,202(2),268-274.
MLA	J. J. Guo,et al."Degradation of solderability of electroless nickel by phosphide particles".Surface & Coatings Technology 202.2(2007):268-274.