Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder

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	Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder
	J. J. Guo; L. Zhang; A. P. Xian; J. K. Shang
	2007
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	23 期号:6 页码:811-816
摘要	Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe plating as both the wetting force and kinetics approached or exceeded those on the pure Ni. However, upon further increase in Fe content to 75 at. pct, the solderability of the alloy was severely degraded even though it was still better than that of the pure Fe plating. X-ray photoelectron spectroscopy showed that such a strong dependence of solderability on Fe content is related to the much thinner, incomplete oxide coverage of Ni-rich plating surface.
部门归属	[guo, jianjun; zhang, lei; xian, aiping; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, jk (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jkshang@imr.ac.cn
关键词	Solderability Feni Alloys Lead-free Solders Wetting Electroless-nickel/solder Interface Enig Plating Layer Thermal-stability Sn-0.4cu Solder Cu Substrate Plated Kovar Sn Reflow Copper Part
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WOS记录号	WOS:000251621300012
引用统计	被引频次：26[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33559
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	J. J. Guo,L. Zhang,A. P. Xian,et al. Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder[J]. Journal of Materials Science & Technology,2007,23(6):811-816.
APA	J. J. Guo,L. Zhang,A. P. Xian,&J. K. Shang.(2007).Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder.Journal of Materials Science & Technology,23(6),811-816.
MLA	J. J. Guo,et al."Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder".Journal of Materials Science & Technology 23.6(2007):811-816.