Nanoindentation of lead-free solders in microelectronic packaging

IMR OpenIR

	Nanoindentation of lead-free solders in microelectronic packaging; Nanoindentation of lead-free solders in microelectronic packaging
	C. Z. Liu; J. Chen
	2007 ; 2007
发表期刊	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing ; Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
ISSN	0921-5093 ; 0921-5093
卷号	448 期号:1-2 页码:340-344
摘要	Lead-free eutectic SnBi and SnAgCu solder alloys were studied by nanoindenter. Eutectic SnPb solder was also examined for comparative purpose. Their mechanical properties including hardness, reduced modulus and creep rate sensitivity coefficient m values were obtained. It was found that eutectic SnAgCu solder is stiffer than both eutectic SnBi solder and SnPb solder, while eutectic SnBi is the hardest among these solder alloys. For eutectic SnAgCu alloy, its m value obtained by nanoindenter was in excellent agreement with that by uniaxial tensile test. Both lead-free solders showed more creep resistance than eutectic SnPb solder. Nanoindenter is a useful way to characterize the small sized materials of electronic components. (c) 2006 Elsevier B.V. All rights reserved.; Lead-free eutectic SnBi and SnAgCu solder alloys were studied by nanoindenter. Eutectic SnPb solder was also examined for comparative purpose. Their mechanical properties including hardness, reduced modulus and creep rate sensitivity coefficient m values were obtained. It was found that eutectic SnAgCu solder is stiffer than both eutectic SnBi solder and SnPb solder, while eutectic SnBi is the hardest among these solder alloys. For eutectic SnAgCu alloy, its m value obtained by nanoindenter was in excellent agreement with that by uniaxial tensile test. Both lead-free solders showed more creep resistance than eutectic SnPb solder. Nanoindenter is a useful way to characterize the small sized materials of electronic components. (c) 2006 Elsevier B.V. All rights reserved.
部门归属	shenyang inst aeronaut engn, dept mat engn, shenyang 110034, peoples r china. chinese acad sci, inst met res, shenyang 110016, peoples r china.;liu, cz (reprint author), shenyang inst aeronaut engn, dept mat engn, shenyang 110034, peoples r china;chunzliu@yahoo.com ; shenyang inst aeronaut engn, dept mat engn, shenyang 110034, peoples r china. chinese acad sci, inst met res, shenyang 110016, peoples r china.;liu, cz (reprint author), shenyang inst aeronaut engn, dept mat engn, shenyang 110034, peoples r china;chunzliu@yahoo.com
关键词	Solder Solder Nanoindentation Nanoindentation Hardness Hardness Modulus Modulus Creep Creep Creep Creep Microstructure Microstructure Indentation Indentation Alloys Alloys Behavior Behavior Joints Joints
URL	查看原文 ; 查看原文
WOS记录号	WOS:000244791100048 ; WOS:000244791100048
引用统计	被引频次：42[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33690
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	C. Z. Liu,J. Chen. Nanoindentation of lead-free solders in microelectronic packaging, Nanoindentation of lead-free solders in microelectronic packaging[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2007, 2007,448, 448(1-2):340-344, 340-344.
APA	C. Z. Liu,&J. Chen.(2007).Nanoindentation of lead-free solders in microelectronic packaging.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,448(1-2),340-344.
MLA	C. Z. Liu,et al."Nanoindentation of lead-free solders in microelectronic packaging".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 448.1-2(2007):340-344.