Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling

IMR OpenIR

	Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling; Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling; Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling
	W. Wang; Z. G. Wang; A. P. Xian; J. K. Shang
	2007 ; 2007 ; 2007
发表期刊	Journal of Materials Science & Technology ; Journal of Materials Science & Technology ; Journal of Materials Science & Technology
ISSN	1005-0302 ; 1005-0302 ; 1005-0302
卷号	23 期号:1 页码:85-91
摘要	Two kinds of CBGA (ceramic ball grid array) assemblies were made by reflow soldering process using two different Pb-free solders. Microstructural evolution and cracks induced by thermal cycling in CBGA assemblies were examined by scanning electron microscopy (SEM) and finite element method (FEM). Before thermal cycling, intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn were observed at the solder interface between Cu and Ag metallizations, respectively. After thermal cycling, another IMC Cu3Sn was observed near the Cu pad in both two assemblies and the layers of Cu6Sn5 and Ag3Sn became thicker. As a result of thermal cycling, cyclic stress and strain were accumulated in the solder joint leading to fatigue cracking. Both experiments and FEM revealed that cracks preferred to initiate at the corner of each solder joint. Multi-modes of the crack propagation were found in the two assemblies. Based on Coffin-Manson equation, the thermal fatigue life was calculated and the predicted life showed good agreement with the experimental results.; Two kinds of CBGA (ceramic ball grid array) assemblies were made by reflow soldering process using two different Pb-free solders. Microstructural evolution and cracks induced by thermal cycling in CBGA assemblies were examined by scanning electron microscopy (SEM) and finite element method (FEM). Before thermal cycling, intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn were observed at the solder interface between Cu and Ag metallizations, respectively. After thermal cycling, another IMC Cu3Sn was observed near the Cu pad in both two assemblies and the layers of Cu6Sn5 and Ag3Sn became thicker. As a result of thermal cycling, cyclic stress and strain were accumulated in the solder joint leading to fatigue cracking. Both experiments and FEM revealed that cracks preferred to initiate at the corner of each solder joint. Multi-modes of the crack propagation were found in the two assemblies. Based on Coffin-Manson equation, the thermal fatigue life was calculated and the predicted life showed good agreement with the experimental results.; Two kinds of CBGA (ceramic ball grid array) assemblies were made by reflow soldering process using two different Pb-free solders. Microstructural evolution and cracks induced by thermal cycling in CBGA assemblies were examined by scanning electron microscopy (SEM) and finite element method (FEM). Before thermal cycling, intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn were observed at the solder interface between Cu and Ag metallizations, respectively. After thermal cycling, another IMC Cu3Sn was observed near the Cu pad in both two assemblies and the layers of Cu6Sn5 and Ag3Sn became thicker. As a result of thermal cycling, cyclic stress and strain were accumulated in the solder joint leading to fatigue cracking. Both experiments and FEM revealed that cracks preferred to initiate at the corner of each solder joint. Multi-modes of the crack propagation were found in the two assemblies. Based on Coffin-Manson equation, the thermal fatigue life was calculated and the predicted life showed good agreement with the experimental results.
部门归属	chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china. univ illinois, dept mat sci & engn, urbana, il 61801 usa.;wang, zg (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhgwang@imr.ac.cn ; chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china. univ illinois, dept mat sci & engn, urbana, il 61801 usa.;wang, zg (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhgwang@imr.ac.cn ; chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china. univ illinois, dept mat sci & engn, urbana, il 61801 usa.;wang, zg (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhgwang@imr.ac.cn
关键词	Cbga Cbga Cbga Thermal Cycling Thermal Cycling Thermal Cycling Fem Fem Fem Assembly Assembly Assembly Cracking Cracking Cracking Solder Joint Reliability Solder Joint Reliability Solder Joint Reliability Level Reliability Level Reliability Level Reliability Flex-substrate Flex-substrate Flex-substrate Interconnect Interconnect Interconnect Snagcu Snagcu Snagcu Bga Bga Bga Segregation Segregation Segregation Packages Packages Packages Behavior Behavior Behavior Bismuth Bismuth Bismuth
URL	查看原文 ; 查看原文 ; 查看原文
WOS记录号	WOS:000244047500012 ; WOS:000244047500012 ; WOS:000244047500012
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33873
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	W. Wang,Z. G. Wang,A. P. Xian,et al. Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling, Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling, Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling[J]. Journal of Materials Science & Technology, Journal of Materials Science & Technology, Journal of Materials Science & Technology,2007, 2007, 2007,23, 23, 23(1):85-91, 85-91, 85-91.
APA	W. Wang,Z. G. Wang,A. P. Xian,&J. K. Shang.(2007).Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling.Journal of Materials Science & Technology,23(1),85-91.
MLA	W. Wang,et al."Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling".Journal of Materials Science & Technology 23.1(2007):85-91.