Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer

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	Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer
	X. H. Yin; M. S. Li; T. P. Li; Y. C. Zhou
	2007
发表期刊	Journal of Materials Science
ISSN	0022-2461
卷号	42 期号:17 页码:7081-7085
摘要	Based on the structure characteristic of Ti3AlC2 and the easy formation of Ti3Al1 -x Si (x) C-2 solid solution, a Si interlayer was selected to join Ti3AlC2 layered ceramic by diffusion bonding method. Joining was performed at 1,300-1,400 degrees C for 120 min under 5 MPa load in an Ar atmosphere. The phase composition and interface microstructure of the joints were investigated by XRD, SEM and EPMA. The results revealed that Ti3Al(Si)C-2 solid solution formed at the interface. The mechanism of bonding is attributed to silicon diffusing inward the Ti3AlC2. The strength of joints was evaluated by a 3-point bending test. The jointed specimens exhibit a high flexural strength of 285 +/- 11 MPa, which is about 80% of that of the Ti3AlC2; and retain this strength up to 1,000 degrees C. The high mechanical performance of the joints indicates that diffusion bonding via a Si interlayer is effective to bond Ti3AlC2 ceramic.
部门归属	chinese acad sci, inst met res, shenyang natl lab mat sci, high performance ceram div, shenyang 110016, peoples r china. chinese acad sci, grad sch, beijing 100039, peoples r china.;li, ms (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, high performance ceram div, 72 wenhua rd, shenyang 110016, peoples r china;mshli@imr.ac.cn yczhou@imr.ac.cn
关键词	Liquid Reaction Synthesis Oxidation Behavior Solid-solutions Aluminum Ti2alc Al
URL	查看原文
WOS记录号	WOS:000247934800005
引用统计	被引频次：29[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33998
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	X. H. Yin,M. S. Li,T. P. Li,et al. Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer[J]. Journal of Materials Science,2007,42(17):7081-7085.
APA	X. H. Yin,M. S. Li,T. P. Li,&Y. C. Zhou.(2007).Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer.Journal of Materials Science,42(17),7081-7085.
MLA	X. H. Yin,et al."Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer".Journal of Materials Science 42.17(2007):7081-7085.