| In-situ synthesis of Ti3AlC2/TiC-Al2O3 composite from TiO2-Al-C system | |
| J. X. Chen; J. L. Li; Y. C. Zhou | |
| 2006 | |
| Source Publication | Journal of Materials Science & Technology
 |
| ISSN | 1005-0302 |
| Volume | 22Issue:4Pages:455-458 |
| Abstract | Ti3AlC2/TiC-Al2O3 composite was synthesized by a combustion reaction in TiO2-Al-C system. The effect of the compositions in raw materials on the products was investigated. Ti3AlC2/TiC-Al2O3 composite was obtained at the molar ratio of TiO2:Al:C=3.0:5.0 similar to 5.1:1.8 similar to 2.0. The reaction path for the 3TiO(2)-5Al-2C system was proposed. Al3Ti, Ti2O3, TiO, and delta-Al2O3 are found to be transitional phases. Finally, Ti3AlC2/TiC-Al2O3 composite forms at similar to 900 degrees C of furnace temperature. The measured Vickers hardness, fracture toughness, and flexural strength of the nearly dense sample from 3TiO(2)-5Al-2C are 13.3 +/- 1.1 GPa, 5.8 +/- 0.3 MPa(.)m(1/2), and 466 +/- 39 MPa, respectively. |
| description.department | chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;zhou, yc (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;yczhou@imr.ac.cn |
| Keyword | Ti3alc2 Tic Al2o3 Tio2-al-c Reaction Path Liquid Reaction Synthesis Mechanical-properties Ti3alc2 |
| URL | 查看原文 |
| WOS ID | WOS:000239637200006 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/34141 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | J. X. Chen,J. L. Li,Y. C. Zhou. In-situ synthesis of Ti3AlC2/TiC-Al2O3 composite from TiO2-Al-C system[J]. Journal of Materials Science & Technology,2006,22(4):455-458. |
| APA | J. X. Chen,J. L. Li,&Y. C. Zhou.(2006).In-situ synthesis of Ti3AlC2/TiC-Al2O3 composite from TiO2-Al-C system.Journal of Materials Science & Technology,22(4),455-458. |
| MLA | J. X. Chen,et al."In-situ synthesis of Ti3AlC2/TiC-Al2O3 composite from TiO2-Al-C system".Journal of Materials Science & Technology 22.4(2006):455-458. |
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