Electroless Ni-P coating preparation of conductive mica powder by a modified activation process | |
H. B. Dai; H. X. Li; F. H. Wang | |
2006 | |
发表期刊 | Applied Surface Science
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ISSN | 0169-4332 |
卷号 | 253期号:5页码:2474-2480 |
摘要 | A modified activation process was developed for electroless Ni-P coating preparation of conductive mica powder. The electroless Ni-P coating process was modified by replacing the conventional sensitization and activation steps only using activation step with a Pd(II)-APTHS activator, which is a complex of Pd(II) ion with a derivate gamma-aminopropyttrihydroxysilane (APTHS) from the hydrolysis of gamma-aminopropyltriethoxysilane (APTES). The activated reaction progress and resulted Ni-P coating were characterized by XPS, SEM/EDX and TEM. Electroless nickel deposition was successfully initiated by this activation process. This activation process is very simple, and the obtained Ni-P deposits have the advantages of uniformity, continuity and densification. The average specific resistivity for the Ni-P coated mica powder was 4.85 x 10(-2) ohm cm. (c) 2006 Elsevier B.V. All rights reserved. |
部门归属 | chinese acad sci, met res inst, state key lab corros & protect, shenyang 110016, peoples r china.;dai, hb (reprint author), chinese acad sci, met res inst, state key lab corros & protect, wencui rd 62, shenyang 110016, peoples r china;hbdai@imr.ac.cn |
关键词 | Electroless Ni-p Coating Conductive Powder Mica Activation Metal-deposition Silane Adsorption Ligands Metallization Monolayers Mechanism Surfaces Features Fiber |
URL | 查看原文 |
WOS记录号 | WOS:000243244300021 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/34165 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | H. B. Dai,H. X. Li,F. H. Wang. Electroless Ni-P coating preparation of conductive mica powder by a modified activation process[J]. Applied Surface Science,2006,253(5):2474-2480. |
APA | H. B. Dai,H. X. Li,&F. H. Wang.(2006).Electroless Ni-P coating preparation of conductive mica powder by a modified activation process.Applied Surface Science,253(5),2474-2480. |
MLA | H. B. Dai,et al."Electroless Ni-P coating preparation of conductive mica powder by a modified activation process".Applied Surface Science 253.5(2006):2474-2480. |
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