Deformation twinning in polycrystalline copper at room temperature and low strain rate

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	Deformation twinning in polycrystalline copper at room temperature and low strain rate
	C. X. Huang; K. Wang; S. D. Wu; Z. F. Zhang; G. Y. Li; S. Li
	2006
发表期刊	Acta Materialia
ISSN	1359-6454
卷号	54 期号:3 页码:655-665
摘要	Deformation twins were widely observed in polycrystalline Cu with grain sizes varying from micrometers to nanometers during the process of equal channel angular pressing at room temperature and low strain rate (similar to 10(-2)s(-1)). The microstructures of deformation twins were characterized by a transmission electron microscope (TEM) and a high-resolution TEM. It was found that deformation twinning in coarse-grained Cu occurred mainly in shear bands and their intersections as a result of the very high local stress resulted from the severe plastic deformation, and followed the well known pole mechanism. With a decrease in the grain size down to submicrometer (< 1 mu m) and nanometer (< 100 nm) dimensions, twinning was observed to take place via partial dislocation emission from grain boundaries and grain boundary junctions, which is different from the pole mechanism operating in coarse-grained Cu. These observations are consistent with the predictions of recent molecular dynamic simulations for nanocrystalline face-centered cubic materials. The deformation conditions required for twinning and the formation mechanism of deformation twins varying with grain size in Cu are discussed. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;wu, sd (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;shdwu@imr.ac.cn
关键词	Deformation Twinning Cu Nanostructured Material Equal Channel Angular Pressings Shear Band Molecular-dynamics Simulation Stacking-fault Energy Single-crystals Grain-size NanocrystAlline Al Substructure Development Plastic-deformation Metals Cu Aluminum
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WOS记录号	WOS:000235418600009
引用统计	被引频次：244[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/34253
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	C. X. Huang,K. Wang,S. D. Wu,et al. Deformation twinning in polycrystalline copper at room temperature and low strain rate[J]. Acta Materialia,2006,54(3):655-665.
APA	C. X. Huang,K. Wang,S. D. Wu,Z. F. Zhang,G. Y. Li,&S. Li.(2006).Deformation twinning in polycrystalline copper at room temperature and low strain rate.Acta Materialia,54(3),655-665.
MLA	C. X. Huang,et al."Deformation twinning in polycrystalline copper at room temperature and low strain rate".Acta Materialia 54.3(2006):655-665.