Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation

IMR OpenIR

	Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation; Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation
	C. Z. Liu; J. Chen; P. L. Liu; J. K. Shang
	2006 ; 2006
发表期刊	Journal of Materials Science & Technology ; Journal of Materials Science & Technology
ISSN	1005-0302 ; 1005-0302
卷号	22 期号:1 页码:130-134
摘要	Nanoindentation was used to probe softening of the eutectic microstructure in a SnBi/Cu interconnect following thermal aging. Tests were conducted at constant loading rates and under constant loads to characterize the flow stress and creep behavior of the eutectic microstructure. Aging was found to reduce the flow stress but to increase strain-rate sensitivity of the eutectic SnBi microstructure. While the reduction in the flow stress was related to the coarsening of the eutectic microstructure, the increased creep rate sensitivity was resulted from additional contribution of grain boundary movement to indentation creep.; Nanoindentation was used to probe softening of the eutectic microstructure in a SnBi/Cu interconnect following thermal aging. Tests were conducted at constant loading rates and under constant loads to characterize the flow stress and creep behavior of the eutectic microstructure. Aging was found to reduce the flow stress but to increase strain-rate sensitivity of the eutectic SnBi microstructure. While the reduction in the flow stress was related to the coarsening of the eutectic microstructure, the increased creep rate sensitivity was resulted from additional contribution of grain boundary movement to indentation creep.
部门归属	chinese acad sci, shenyang natl lab mat sci, met res inst, shenyang 110016, peoples r china. shenyang inst aeronaut engn, dept mat engn, shenyang 110034, peoples r china. univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, jk (reprint author), chinese acad sci, shenyang natl lab mat sci, met res inst, shenyang 110016, peoples r china;jkshang@imr.ac.cn ; chinese acad sci, shenyang natl lab mat sci, met res inst, shenyang 110016, peoples r china. shenyang inst aeronaut engn, dept mat engn, shenyang 110034, peoples r china. univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, jk (reprint author), chinese acad sci, shenyang natl lab mat sci, met res inst, shenyang 110016, peoples r china;jkshang@imr.ac.cn
关键词	Solder Solder Interconnect Interconnect Nanoindentation Nanoindentation Creep Creep Deformation Deformation Lead-free Solders Lead-free Solders Sn-ag Sn-ag Creep Creep Temperature Temperature Tin Tin Pb Pb Segregation Segregation Behavior Behavior Fatigue Fatigue Bismuth Bismuth
URL	查看原文 ; 查看原文
WOS记录号	WOS:000235151200022 ; WOS:000235151200022
引用统计	被引频次：17[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/34343
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	C. Z. Liu,J. Chen,P. L. Liu,et al. Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation, Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation[J]. Journal of Materials Science & Technology, Journal of Materials Science & Technology,2006, 2006,22, 22(1):130-134, 130-134.
APA	C. Z. Liu,J. Chen,P. L. Liu,&J. K. Shang.(2006).Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation.Journal of Materials Science & Technology,22(1),130-134.
MLA	C. Z. Liu,et al."Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation".Journal of Materials Science & Technology 22.1(2006):130-134.