Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples

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	Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples; Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples
	L. Xu; Y. Y. Cui; Y. L. Hao; R. Yang
	2006 ; 2006
发表期刊	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing ; Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
ISSN	0921-5093 ; 0921-5093
卷号	435 页码:638-647
摘要	Solid-state reactive diffusion between Ti and Al was investigated in the temperature range of 520-650 degrees C by employing multi-laminated Ti/Al diffusion couples. In samples annealed up to 150 h intermetallic TiAl3 is the only phase observed in the diffusion zone and the preferential formation of this compound in Ti/Al diffusion couples was predicted using an effective heat of formation model. The present work indicated that both Ti and Al diffused into each other and the growth of the TiAl3 layers occurred mainly towards the Al side. The TiAl3 growth changes from parabolic to linear kinetics between 575 and 600 degrees C, characterized by activation energy of 33.2 and 295.8 kJ mol(-1), respectively. It is suggested that the low-temperature kinetics is dominated by the diffusion of Ti atoms along the grain boundaries of the TiAl3 layers, while the reaction at the TiAl3/Al interfaces in the high-temperature regime is limited by the diffusion of Ti atoms in the Al foils as a result of increased solubility of Ti in Al with increasing temperature. (c) 2006 Elsevier B.V. All rights reserved.; Solid-state reactive diffusion between Ti and Al was investigated in the temperature range of 520-650 degrees C by employing multi-laminated Ti/Al diffusion couples. In samples annealed up to 150 h intermetallic TiAl3 is the only phase observed in the diffusion zone and the preferential formation of this compound in Ti/Al diffusion couples was predicted using an effective heat of formation model. The present work indicated that both Ti and Al diffused into each other and the growth of the TiAl3 layers occurred mainly towards the Al side. The TiAl3 growth changes from parabolic to linear kinetics between 575 and 600 degrees C, characterized by activation energy of 33.2 and 295.8 kJ mol(-1), respectively. It is suggested that the low-temperature kinetics is dominated by the diffusion of Ti atoms along the grain boundaries of the TiAl3 layers, while the reaction at the TiAl3/Al interfaces in the high-temperature regime is limited by the diffusion of Ti atoms in the Al foils as a result of increased solubility of Ti in Al with increasing temperature. (c) 2006 Elsevier B.V. All rights reserved.
部门归属	chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;yang, r (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;ryang@imr.ac.cn ; chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;yang, r (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;ryang@imr.ac.cn
关键词	Growth Behavior Growth Behavior Tial3 Layer Tial3 Layer Ti/al Diffusion Couples Ti/al Diffusion Couples Phase Prediction Phase Prediction Titanium-aluminum System Titanium-aluminum System Phase Formation Sequence Phase Formation Sequence Thin-film Systems Thin-film Systems Ti-al System Ti-al System Soldering Reaction Soldering Reaction Mil Composites Mil Composites Formation Rule Formation Rule Effective Heat Effective Heat Eutectic Snpb Eutectic Snpb Tial3 Layer Tial3 Layer
URL	查看原文 ; 查看原文
WOS记录号	WOS:000241683200086 ; WOS:000241683200086
引用统计	被引频次：247[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/34627
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	L. Xu,Y. Y. Cui,Y. L. Hao,et al. Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples, Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2006, 2006,435, 435:638-647, 638-647.
APA	L. Xu,Y. Y. Cui,Y. L. Hao,&R. Yang.(2006).Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,435,638-647.
MLA	L. Xu,et al."Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 435(2006):638-647.