Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD

IMR OpenIR

	Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD
	M. Yu; J. Z. Zhang; D. X. Li; Q. L. Meng; W. Z. Li
	2006
发表期刊	Surface & Coatings Technology
ISSN	0257-8972
卷号	201 期号:3-4 页码:1243-1249
摘要	Three groups of copper films were deposited on the surfaces of the Si (100) crystal by both metal vapor vacuum arc (MEVVA) ion implantation and ion beam assistant deposition (IBAD) technologies. Before coating Cu film by IBAD two groups of the samples were implanted by 68keV Cu ion with fluence of 3 x 10(17) ion s/cm(2). Different sputtering ion densities and deposition times of IBAD were selected for three groups of the samples. The internal stresses in the copper films were analyzed by X-ray diffraction (XRD). The morphologies of the copper films and cross-section micrographs were observed by scanning electron microscopy (SEM). The adhesive strength of the Cu films was measured by a nano indenter. The experimental data indicate that all the copper films possessed compressive stress, which was increased as the film thickness increased. The internal stresses of the samples prepared without Cu ion implantation were minimum among three groups of the samples. The adhesive strength of the samples prepared with MEVVA ion implantation was much higher than one of the samples prepared without MEVVA ion implantation. (c) 2006 Elsevier B.V. All rights reserved.
部门归属	tsing hua univ, dept mat sci & engn, adv mat lab, beijing 100084, peoples r china. chinese ctr adv sci & technol, beijing 100080, peoples r china. chinese acad sci, int ctr mat phys, shenyang 110016, peoples r china. state key labtribol, beijing 100084, peoples r china.;zhang, jz (reprint author), tsing hua univ, dept mat sci & engn, adv mat lab, beijing 100084, peoples r china;zjz@mail.tsinghua.edu.cn
关键词	Mevva Ibad Copper Film Compressive Stress Adhesion Deposited Thin-films Intrinsic Stress Residual-stress Cosi2 Films Bombardment Diamond
URL	查看原文
WOS记录号	WOS:000244477300101
引用统计	被引频次：26[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/34671
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	M. Yu,J. Z. Zhang,D. X. Li,et al. Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD[J]. Surface & Coatings Technology,2006,201(3-4):1243-1249.
APA	M. Yu,J. Z. Zhang,D. X. Li,Q. L. Meng,&W. Z. Li.(2006).Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD.Surface & Coatings Technology,201(3-4),1243-1249.
MLA	M. Yu,et al."Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD".Surface & Coatings Technology 201.3-4(2006):1243-1249.