Length-scale-controlled fatigue mechanisms in thin copper films

IMR OpenIR

	Length-scale-controlled fatigue mechanisms in thin copper films
	G. P. Zhang; C. A. Volkert; R. Schwaiger; P. Wellner; E. Arzt; O. Kraft
	2006
发表期刊	Acta Materialia
ISSN	1359-6454
卷号	54 期号:11 页码:3127-3139
摘要	Systematic investigations of fatigue damage and dislocation structures in thin Cu films with different thicknesses (0.2-3.0 mu m) and grain sizes (0.3-2.1 mu m mean diameter) were carried out using focused ion beam microscopy and transmission electron microscopy. The morphologies of fatigue-induced extrusions, cracks, and dislocation structures were studied and found to be controlled by film thickness and grain size. When either of these length scales is decreased below roughly 1 mu m, the typical dislocation wall and cell structures found in fatigued coarse-grained bulk materials no longer develop and are replaced by individual dislocations. Similarly, the typical surface damage of fatigued bulk metals, such as extrusions and cracks near extrusions, is gradually suppressed and replaced by damage that is localized at interfaces, such as cracks, grooves, and voids along grain and twin boundaries. This gradual transition from damage characteristic of bulk metals to damage localized at interfaces is attributed to constraints on dislocation activity at submicrometer length scales. Based on the experimental results and a theoretical analysis of extrusion formation, a mechanistic map of fatigue damage behavior is proposed that summarizes this length scale dependence. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. max planck inst met res, d-70569 stuttgart, germany. forschungszentrum karlsruhe, inst mat forsch 2, d-76021 karlsruhe, germany.;zhang, gp (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;gpzhang@imr.ac.cn
关键词	Fatigue Thin Films Length Scale Dislocation Structure Interfaces Severe Plastic-deformation Ultrafine-grained Copper Cyclic Deformation Strain Amplitude Dislocation-structures Crack Initiation Single-crystals Metal-films Behavior Size
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WOS记录号	WOS:000238468100024
引用统计	被引频次：150[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/34680
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	G. P. Zhang,C. A. Volkert,R. Schwaiger,et al. Length-scale-controlled fatigue mechanisms in thin copper films[J]. Acta Materialia,2006,54(11):3127-3139.
APA	G. P. Zhang,C. A. Volkert,R. Schwaiger,P. Wellner,E. Arzt,&O. Kraft.(2006).Length-scale-controlled fatigue mechanisms in thin copper films.Acta Materialia,54(11),3127-3139.
MLA	G. P. Zhang,et al."Length-scale-controlled fatigue mechanisms in thin copper films".Acta Materialia 54.11(2006):3127-3139.