Investigation on quenching at a high-angle Cu grain boundary on an atomic scale

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	Investigation on quenching at a high-angle Cu grain boundary on an atomic scale
	L. Zhang; S. Q. Wang; H. Q. Ye
	2006
发表期刊	Chinese Physics
ISSN	1009-1963
卷号	15 期号:3 页码:610-617
摘要	We have performed molecular dynamics simulations of structural changes clue to quenching the melting interface at a Cu Sigma 5(310)/[001] symmetrical tilt grain boundary. The simulation results suggest that the grain boundary structures due to quenching are different from those clue to heating up to the same temperature. The calculated atom density profiles show that the grain boundary structures can be significantly changed as they are quenched to quite low temperatures.
部门归属	ne univ, coll sci, shenyang 110004, peoples r china. chinese acad sci, shenyang natl lab mat sci, met res inst, shenyang 110016, peoples r china.;zhang, l (reprint author), ne univ, coll sci, shenyang 110004, peoples r china;gsj-cn@tom.com
关键词	Molecular Dynamics Solidification Crystal Interface Molecular-dynamics Simulation Melting Transition Tilt Boundaries Aluminum Diffusion Silicon Copper
URL	查看原文
WOS记录号	WOS:000235875800028
引用统计	被引频次：19[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/34698
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	L. Zhang,S. Q. Wang,H. Q. Ye. Investigation on quenching at a high-angle Cu grain boundary on an atomic scale[J]. Chinese Physics,2006,15(3):610-617.
APA	L. Zhang,S. Q. Wang,&H. Q. Ye.(2006).Investigation on quenching at a high-angle Cu grain boundary on an atomic scale.Chinese Physics,15(3),610-617.
MLA	L. Zhang,et al."Investigation on quenching at a high-angle Cu grain boundary on an atomic scale".Chinese Physics 15.3(2006):610-617.