High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins | |
X. Zhang; H. Wang; X. H. Chen; L. Lu; K. Lu; R. G. Hoagland; A. Misra | |
2006 | |
发表期刊 | Applied Physics Letters
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ISSN | 0003-6951 |
卷号 | 88期号:17 |
摘要 | Bulk Cu foils have been synthesized via magnetron sputtering with an average twin spacing of 5 nm. Twin interfaces are of {111} type and normal to the growth direction. Growth twins with such high twin density and preferred orientation have never been observed in elemental metals. These Cu foils exhibited tensile strengths of 1.2 GPa, a factor of 3 higher than that reported earlier for nanocrystalline Cu, average uniform elongation of 1%-2%, and ductile dimple fracture surfaces. This work provides a route for the synthesis of ultrahigh-strength, ductile pure metals via control of twin spacing and twin orientation in vapor-deposited materials. (c) 2006 American Institute of Physics. |
部门归属 | texas a&m univ, dept engn mech, college stn, tx 77843 usa. texas a&m univ, dept elect engn, college stn, tx 77843 usa. chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. los alamos natl lab, mat sci & technol div, los alamos, nm 87545 usa.;zhang, x (reprint author), texas a&m univ, dept engn mech, college stn, tx 77843 usa;zhangx@tamu.edu |
关键词 | Nanocrystalline Copper Ductility Metals Size |
URL | 查看原文 |
WOS记录号 | WOS:000237136600077 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/34715 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | X. Zhang,H. Wang,X. H. Chen,et al. High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins[J]. Applied Physics Letters,2006,88(17). |
APA | X. Zhang.,H. Wang.,X. H. Chen.,L. Lu.,K. Lu.,...&A. Misra.(2006).High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins.Applied Physics Letters,88(17). |
MLA | X. Zhang,et al."High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins".Applied Physics Letters 88.17(2006). |
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