Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07

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	Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07
	Q. S. Zhu; Z. F. Zhang; J. K. Shang; Z. Wang
	2006
发表期刊	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
ISSN	0921-5093
卷号	435 页码:588-594
摘要	Sn-Ag-Cu solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Scallop-type CU6Sn5 and planar-type CU6Sn5/CU3Sn intermetallic compounds (IMCs) interfaces were formed between SnAgCu solder and copper single crystal after re-flowing at 240 degrees C and subsequent aging at 170 degrees C, respectively. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the SnAgCu solder/copper single crystal joint. Two types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the experimental observations above, the corresponding interfacial fatigue cracking mechanisms were discussed. (c) 2006 Elsevier B.V. All rights reserved.
部门归属	chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china. univ illinois, dept mat sci & engn, urbana, il 61801 usa.;zhang, zf (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Sn-ag-cu Solder Copper Single Crystal Intermetallic Compounds (Imcs) Interface Cyclic Deformation Persistent Slip Bands (Psbs) Fatigue Cracking Persistent Slip Bands Pb-free Solders Intermetallic Compounds Cyclic Deformation Joints Behavior Growth Microstructure Evolution Strength
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/34781
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. S. Zhu,Z. F. Zhang,J. K. Shang,et al. Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2006,435:588-594.
APA	Q. S. Zhu,Z. F. Zhang,J. K. Shang,&Z. Wang.(2006).Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,435,588-594.
MLA	Q. S. Zhu,et al."Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 435(2006):588-594.