Surface deformation features in ultrafine-grained copper cyclically stressed at different temperatures

IMR OpenIR

	Surface deformation features in ultrafine-grained copper cyclically stressed at different temperatures
	X. W. Li; S. D. Wu; Y. Wu; H. Y. Yasuda; Y. Umakoshi
	2005
发表期刊	Materials Transactions
ISSN	1345-9678
卷号	46 期号:12 页码:3077-3080
摘要	The surface deformation features in ultrafine-grained copper produced by equal channel angular (ECA) pressing. which was cyclically deformed at temperatures between room temperature and 573 K under a constant stress amplitude of 200 MPa, were investigated. It was found that the surface deformation features and damage behaviour are strongly dependent upon the testing temperature. For examples, large-scale shear bands (SBs) formed at room temperature, whereas finer and discontinuous S13s, instead of large-scale SBs. were found to become the dominant feature with increasing temperature (below recrystallization), resulting from the reduction in quantity and volume fraction of grain boundaries as a consequence of grain growth and the enhanced dislocation slip. When the temperature is above recrystallization, no clear SBs were observed and dislocation slip deformation within grains governed the plastic deformation of UFG copper. causing nucleation of cracks along slip bands in grains or along grain boundaries, in contrast to the nucleation along SBs at temperatures below recrystallization.
部门归属	osaka univ, grad sch engn, dept mat sci, suita, osaka 5650871, japan. osaka univ, grad sch engn, engn & frontier res ctr, suita, osaka 5650871, japan. northeastern univ, coll sci, shenyang 110004, peoples r china. chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. osaka univ, res ctr ultra high voltage electron microscopy, ibaraki 5670047, japan.;li, xw (reprint author), osaka univ, grad sch engn, dept mat sci, 2-2 yamadaoka, suita, osaka 5650871, japan;xwli@mat.eng.osaka-u.ac.jp
关键词	Ultrafine-grained Copper Equal Channel Angular Pressing Cyclic Deformation High Temperature Shear Bands Dislocation Slip Recrystallization Severe Plastic-deformation Boundary Migration Single-crystals Shear Bands Fatigue Aluminum Ecap
URL	查看原文
WOS记录号	WOS:000234846500092
引用统计	被引频次：7[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/34907
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	X. W. Li,S. D. Wu,Y. Wu,et al. Surface deformation features in ultrafine-grained copper cyclically stressed at different temperatures[J]. Materials Transactions,2005,46(12):3077-3080.
APA	X. W. Li,S. D. Wu,Y. Wu,H. Y. Yasuda,&Y. Umakoshi.(2005).Surface deformation features in ultrafine-grained copper cyclically stressed at different temperatures.Materials Transactions,46(12),3077-3080.
MLA	X. W. Li,et al."Surface deformation features in ultrafine-grained copper cyclically stressed at different temperatures".Materials Transactions 46.12(2005):3077-3080.