Temperature memory effect of Ti50Nb30CU20 (at.%) alloy | |
Y. H. Li; L. H. Rong; Z. T. Wang; G. X. Qi; C. Z. Wang | |
2005 | |
发表期刊 | Journal of Alloys and Compounds
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ISSN | 0925-8388 |
卷号 | 400期号:1-2页码:112-115 |
摘要 | After the reverse thermal induced martensitic transformation process of shape memory alloy is arrested at a temperature between the reverse transformation start and finish temperatures (A(s) and A(f)), and then cooled to a temperature below M-f, a kinetic stop will occur in the next heat flow curve during the heating process. The kinetic stop is closely related to the arrested temperature. This phenomenon is called temperature memory effect (TME). TME of Ti50N60Cu20 (at.%) shape memory alloy with phase transformation between B2 austenite and B19 martensite has been investigated by differential scanning calorimeter in this paper. The results indicate that TME of Ti50Ni30Cu20 alloy only exists in the heating process. (c) 2005 Elsevier B.V. All rights reserved. |
部门归属 | shenyang ligong univ, mat sci & engn coll, shenyang 110168, peoples r china. chinese acad sci, inst met res, shenyang 110016, peoples r china.;li, yh (reprint author), shenyang ligong univ, mat sci & engn coll, shenyang 110168, peoples r china;yhli@imr.ac.cn |
关键词 | Tinicu Alloy Shape Memory Alloy Temperature Memory Effect Incomplete Transformation Ni-cu Alloys Shape-memory Ti-ni Content Dependence Martensitic-transformation Pseudoelasticity Behavior |
URL | 查看原文 |
WOS记录号 | WOS:000231795300021 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/34915 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | Y. H. Li,L. H. Rong,Z. T. Wang,et al. Temperature memory effect of Ti50Nb30CU20 (at.%) alloy[J]. Journal of Alloys and Compounds,2005,400(1-2):112-115. |
APA | Y. H. Li,L. H. Rong,Z. T. Wang,G. X. Qi,&C. Z. Wang.(2005).Temperature memory effect of Ti50Nb30CU20 (at.%) alloy.Journal of Alloys and Compounds,400(1-2),112-115. |
MLA | Y. H. Li,et al."Temperature memory effect of Ti50Nb30CU20 (at.%) alloy".Journal of Alloys and Compounds 400.1-2(2005):112-115. |
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