Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite

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	Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite
	J. Y. Wu; Y. C. Zhou; J. Y. Wang; W. Wang; C. K. Yan
	2005
发表期刊	Zeitschrift Fur Metallkunde
ISSN	0044-3093
卷号	96 期号:11 页码:1314-1320
摘要	Interfacial reaction between Cu and Ti2SnC during the processing of Cu - Ti2SnC composite was investigated by using X-ray diffraction, scanning electron microscopy, and transmission electron microscopy. It is shown that the reaction is closely related to the reaction temperature, reaction time, and relative ratio of Cu and Ti2SnC. The reacting products are Cu(Sn) solid solution and TiCx, and the transporting process during interfacial reaction is described. The interfacial reaction products are further confirmed by measuring the hardness across the interface using nanoindentation test. It is shown that the reaction is controlled by the de-intercalation of Sn from Ti2SnC to form Cu(Sn) solid solution and TiCx, and crystallographic relations of [011] TiCx // [010] Ti2SnC and (111) TiCx // (001) Ti2SnC were observed at the interface. The effect of interfacial reaction on the mechanical and electrical properties of the composite is also discussed.
部门归属	chinese acad sci, met res inst, shenyang natl lab mat sci, high performance ceram div, shenyang 110016, peoples r china.;zhou, yc (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, high performance ceram div, 72 wenhua rd, shenyang 110016, peoples r china;yczhou@imr.ac.cn
关键词	Interface Copper Ti2snc Metal Matrix Composites Dispersion-strengthened Copper Mechanical-properties Ti3sic2 Behavior Stability
URL	查看原文
WOS记录号	WOS:000234083000017
引用统计	被引频次：20[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/35113
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	J. Y. Wu,Y. C. Zhou,J. Y. Wang,et al. Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite[J]. Zeitschrift Fur Metallkunde,2005,96(11):1314-1320.
APA	J. Y. Wu,Y. C. Zhou,J. Y. Wang,W. Wang,&C. K. Yan.(2005).Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite.Zeitschrift Fur Metallkunde,96(11),1314-1320.
MLA	J. Y. Wu,et al."Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite".Zeitschrift Fur Metallkunde 96.11(2005):1314-1320.