Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

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	Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure
	Q. L. Zeng; Z. G. Wang; A. P. Xian; J. K. Shang
	2005
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	34 期号:1 页码:62-67
摘要	Low-cycle fatigue behavior of the Sn-Ag-Cu ternary-eutectic alloy was investigated under a fully reversed loading condition. The solder alloy exhibited cyclic softening early in the fatigue life and continued to soften as the number of fatigue cycles increased. Following cyclic loading, numerous microcracks were found in the microstructure. Most of the microcracks were located along the grain boundaries in the areas with finer grains. The areal density of the microcracks increased with both strain amplitude and cycle number. By combining percolation theory with microcracking analysis, the cycle-dependent softening behavior: was shown to result from accumulation of microcrack density with fatigue cycles.
部门归属	chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. univ illinois, dept mat sci & engn, urbana, il 61801 usa.;zeng, ql (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jkshang@uiuc.edu
关键词	Lead-free Solder Low-cycle Fatigue Cyclic Softening Sn-3.8ag-0.7cu Alloy Sn-ag-cu Fatigue Behavior Bi
URL	查看原文
WOS记录号	WOS:000226633900010
引用统计	被引频次：23[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/35193
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. L. Zeng,Z. G. Wang,A. P. Xian,et al. Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure[J]. Journal of Electronic Materials,2005,34(1):62-67.
APA	Q. L. Zeng,Z. G. Wang,A. P. Xian,&J. K. Shang.(2005).Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure.Journal of Electronic Materials,34(1),62-67.
MLA	Q. L. Zeng,et al."Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure".Journal of Electronic Materials 34.1(2005):62-67.