Damage behavior of 200-nm thin copper films under cyclic loading

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	Damage behavior of 200-nm thin copper films under cyclic loading
	G. P. Zhang; C. A. Volkert; R. Schwaiger; E. Arzt; O. Kraft
	2005
发表期刊	Journal of Materials Research
ISSN	0884-2914
卷号	20 期号:1 页码:201-207
摘要	Fatigue damage in 200-nm-thick Cu films was investigated and compared with the damage in thicker Cu films. The fatigued 200-nm-thick Cu films exhibited only a few, small extrusions and extensive cracking along twin and grain boundaries, whereas the thicker films showed many extrusions/intrusions and cracks lying along the extrusions rather than along the boundaries. This change in fatigue damage behavior with film thickness is attributed to the inhibition of dislocation mobility and the limited availability and activation of dislocation sources on the small length scale. It is argued that the decrease in film thickness and grain size inhibits the localized accumulation of plastic strain within grains, such as at extrusions/intrusions and in extended dislocation structures, and promotes the formation of damage such as cracks at twin and grain boundaries during fatigue. This effect is suggested as the likely cause for the increase in fatigue life with decreasing specimen dimensions.
部门归属	max planck inst metallforsch, d-70569 stuttgart, germany. chinese acad sci, inst met res, lab mat sci, shenyang 110016, peoples r china. forschungszentrum karlshruhe, inst materialforschung 2, karlsruhe, germany. max planck inst metallforsch, d-70569 stuttgart, germany.;zhang, gp (reprint author), max planck inst metallforsch, d-70569 stuttgart, germany;gpzhang@imr.ac.cn
关键词	Crack Initiation Fatigue Behavior Single-crystals Metal-films Dislocation-structures Grain-size Deformation Compression Thickness Tension
URL	查看原文
WOS记录号	WOS:000229292600027
引用统计	被引频次：77[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/35204
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	G. P. Zhang,C. A. Volkert,R. Schwaiger,et al. Damage behavior of 200-nm thin copper films under cyclic loading[J]. Journal of Materials Research,2005,20(1):201-207.
APA	G. P. Zhang,C. A. Volkert,R. Schwaiger,E. Arzt,&O. Kraft.(2005).Damage behavior of 200-nm thin copper films under cyclic loading.Journal of Materials Research,20(1),201-207.
MLA	G. P. Zhang,et al."Damage behavior of 200-nm thin copper films under cyclic loading".Journal of Materials Research 20.1(2005):201-207.