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Preparation of thin solid CoNiFe films by pulse-reverse electroplating technique
Z. Zhang; S. W. Deng; J. Q. Zhang
2005
发表期刊Bulletin of Electrochemistry
ISSN0256-1654
卷号21期号:5页码:233-239
摘要CoNiFe alloys have been prepared by means of pulse-reverse electroplating technique. The effects of the electroplating variables on the deposition of CoNiFe alloys have been investigated by the Taguchi orthogonal array experiment coupled with response surface methodology. The results show that the concentrations of Co2+, Fe2+ and Ni2+ ions, bath temperature, cathodic peak pulse current, and rotating speed influence the composition of CoNiFe electrodeposits. A theoretical analysis of the alloy-plating shows that the anomalous co-deposition of iron-group metals mainly originate from differences in their atomic radii, which results in the differences in the stability and electrochemical reduction rate between their monohydroxide ions. A deposit with a composition of Fe30.50Co64.49Ni5.01 possesses high saturation magnetic flux density and can meet requirements of future micro-electro-mechanical systems.
部门归属zhejiang univ, dept chem, hangzhou 310027, peoples r china. state key lab corros & protect, shenyang 110015, peoples r china.;zhang, z (reprint author), zhejiang univ, dept chem, yu quan campus, hangzhou 310027, peoples r china;eaglezzy@zjuem.zju.edu.cn
关键词Conife Alloy Nanocrystalline Deposits Pulse-reverse Electroplating Anomalous Co-deposition Nickel-iron Anomalous Codeposition Electrodeposition Alloys Density
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WOS记录号WOS:000233580300008
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被引频次:2[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/35246
专题中国科学院金属研究所
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Z. Zhang,S. W. Deng,J. Q. Zhang. Preparation of thin solid CoNiFe films by pulse-reverse electroplating technique[J]. Bulletin of Electrochemistry,2005,21(5):233-239.
APA Z. Zhang,S. W. Deng,&J. Q. Zhang.(2005).Preparation of thin solid CoNiFe films by pulse-reverse electroplating technique.Bulletin of Electrochemistry,21(5),233-239.
MLA Z. Zhang,et al."Preparation of thin solid CoNiFe films by pulse-reverse electroplating technique".Bulletin of Electrochemistry 21.5(2005):233-239.
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