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Experimental verification of the physical model for droplet-particles cleaning in pulsed bias arc ion plating
Y. H. Zhao; G. Q. Lin; C. Dong; L. S. Wen
2005
发表期刊Journal of Materials Science & Technology
ISSN1005-0302
卷号21期号:3页码:423-426
摘要It has been reported that application of pulsed biases in arc ion plating could effectively eliminate droplet particles. The present paper aims at experimental verification of a physical model proposed previously by us which is based on particle charging and repulsion in the pulsed plasma sheath. An orthogonal experiment was designed for this purpose, using the electrical parameters of the pulsed bias for the deposition of TiN films on stainless steel substrates. The effect of these parameters on the amount and the size distribution of the particles were analyzed, and the results provided sufficient evidence for the physical model.
部门归属dalian univ technol, state key lab mat modificat laser ion & electron, dalian 116024, peoples r china. chinese acad sci, inst met res, shenyang 110016, peoples r china.;lin, gq (reprint author), dalian univ technol, state key lab mat modificat laser ion & electron, dalian 116024, peoples r china;gqlin@dlut.edu.cn
关键词Arc Ion Plating Pulsed Bias Tin Film Droplet-particles Tin Deposition Mechanism Coatings Voltage
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WOS记录号WOS:000229594400029
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被引频次:9[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/35272
专题中国科学院金属研究所
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Y. H. Zhao,G. Q. Lin,C. Dong,et al. Experimental verification of the physical model for droplet-particles cleaning in pulsed bias arc ion plating[J]. Journal of Materials Science & Technology,2005,21(3):423-426.
APA Y. H. Zhao,G. Q. Lin,C. Dong,&L. S. Wen.(2005).Experimental verification of the physical model for droplet-particles cleaning in pulsed bias arc ion plating.Journal of Materials Science & Technology,21(3),423-426.
MLA Y. H. Zhao,et al."Experimental verification of the physical model for droplet-particles cleaning in pulsed bias arc ion plating".Journal of Materials Science & Technology 21.3(2005):423-426.
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