The dislocation structure evolution of deformation band and crack formation in a copper bicrystal with a perpendicular grain boundary

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	The dislocation structure evolution of deformation band and crack formation in a copper bicrystal with a perpendicular grain boundary
	Y. Li; S. X. Li; G. Y. Li
	2004
发表期刊	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
ISSN	0921-5093
卷号	372 期号:1-2 页码:221-228
摘要	Cyclic deformation of a copper bicrystal with perpendicular grain boundary (GB) has been performed at room temperature at a constant plastic strain amplitude of 1.5 x 10(-3). The dislocation structure evolution in typical deformation band (DB) as opposed to persistent slip bands (PSB) was observed by electron channelling contrast technique in the scanning electron microscope (SEM) at different cycles. It was found that a micro-crack nucleated preferentially at the interface between matrix and the second type of deformation band (DBII), the habit plane of which is close to the conventional kink plane {1 0 1}, in the vicinity of grain boundary (GB), and propagated along DBII. The dislocation structures of the transgranular and intergranular crack tip were also observed. The main dislocation structure near the crack tip is the cell structure. (C) 2003 Elsevier B.V. All rights reserved.
部门归属	chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china.;li, y (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;yli@imr.ac.cn
关键词	Cyclic Deformation Grain Boundary Copper Bicrystal Crack Tip Deformation Band Persistent Slip Band Persistent Slip Bands Stage-i Propagation High Strain Fatigue Single-crystals Initiation Nucleation Polycrystals Amplitudes Mechanisms Morphology
URL	查看原文
WOS记录号	WOS:000221484600026
引用统计	被引频次：8[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/35426
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Y. Li,S. X. Li,G. Y. Li. The dislocation structure evolution of deformation band and crack formation in a copper bicrystal with a perpendicular grain boundary[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2004,372(1-2):221-228.
APA	Y. Li,S. X. Li,&G. Y. Li.(2004).The dislocation structure evolution of deformation band and crack formation in a copper bicrystal with a perpendicular grain boundary.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,372(1-2),221-228.
MLA	Y. Li,et al."The dislocation structure evolution of deformation band and crack formation in a copper bicrystal with a perpendicular grain boundary".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 372.1-2(2004):221-228.