Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching

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	Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching
	Z. Lin; S. Q. Wang; H. Q. Ye
	2004
Source Publication	Acta Physica Sinica
ISSN	1000-3290
Volume	53 Issue:8 Pages:2497-2502
Abstract	The structure changes of a Cu Sigma = 5 ( 310)/[001] symmetrical tilt grain boundary are investigated using the molecular dynamics method by heating and quenching. The simulated results showed that with increasing temperature, there are structure changes of the grain boundary. At a temperature significantly below the bulk melting point of copper, the grain boundary undergoes a structure change, and there exists the crystal-melt coexistence in the grain boundary zone. The grain boundary structures can be changed by quenching,which are compared to those at the same temperatures by heating.
description.department	chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china.;lin, z (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china
Keyword	Molecular Dynamics Grain Boundary Melt Solidification Liquid Simulation Transition Copper Growth Films
URL	查看原文
WOS ID	WOS:000223179200017
Citation statistics	Cited Times:10[WOS] [WOS Record] [Related Records in WOS]
Document Type	期刊论文
Identifier	http://ir.imr.ac.cn/handle/321006/35447
Collection	中国科学院金属研究所
Recommended Citation GB/T 7714	Z. Lin,S. Q. Wang,H. Q. Ye. Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching[J]. Acta Physica Sinica,2004,53(8):2497-2502.
APA	Z. Lin,S. Q. Wang,&H. Q. Ye.(2004).Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching.Acta Physica Sinica,53(8),2497-2502.
MLA	Z. Lin,et al."Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching".Acta Physica Sinica 53.8(2004):2497-2502.

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