Molecular dynamics study on interfacial energy and atomic structure of Ag/Ni and Cu/Ni heterophase system | |
H. J. Liu; S. Q. Wang; A. Du; C. B. Zhang | |
2004 | |
发表期刊 | Journal of Materials Science & Technology
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ISSN | 1005-0302 |
卷号 | 20期号:6页码:644-648 |
摘要 | The results of molecular dynamics calculations on the interfacial energies and atomic structures of Ag/Ni and Cu/Ni interfaces are presented. Calculation on Ag/Ni interfaces with low-index planes shows that those containing the (111) plane have the lowest energies, which is in agreement with the experiments. Comparing surface energy with interfacial energy, it is found the order of the interfacial energies of Ag/Ni and Cu/Ni containing the planes fall in the same order as solid-vapor surface energies of Ag, Cu and Ni. In this MD simulation, the relaxed atomic structure and dislocation network of (110)(Ag)parallel to(110)(Ni) interface are coincident to HREM observations. |
部门归属 | chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china. northeastern univ, coll sci, shenyang 110004, peoples r china.;wang, sq (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china;sqwang@imr.ac.cn |
关键词 | Molecular Dynamics Interfacial Energy Atomic Structure Heterophase Boundary Fcc Metals Model Boundaries Liquid Nickel |
URL | 查看原文 |
WOS记录号 | WOS:000225623300002 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/35454 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | H. J. Liu,S. Q. Wang,A. Du,et al. Molecular dynamics study on interfacial energy and atomic structure of Ag/Ni and Cu/Ni heterophase system[J]. Journal of Materials Science & Technology,2004,20(6):644-648. |
APA | H. J. Liu,S. Q. Wang,A. Du,&C. B. Zhang.(2004).Molecular dynamics study on interfacial energy and atomic structure of Ag/Ni and Cu/Ni heterophase system.Journal of Materials Science & Technology,20(6),644-648. |
MLA | H. J. Liu,et al."Molecular dynamics study on interfacial energy and atomic structure of Ag/Ni and Cu/Ni heterophase system".Journal of Materials Science & Technology 20.6(2004):644-648. |
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