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Molecular dynamics study on interfacial energy and atomic structure of Ag/Ni and Cu/Ni heterophase system
H. J. Liu; S. Q. Wang; A. Du; C. B. Zhang
2004
发表期刊Journal of Materials Science & Technology
ISSN1005-0302
卷号20期号:6页码:644-648
摘要The results of molecular dynamics calculations on the interfacial energies and atomic structures of Ag/Ni and Cu/Ni interfaces are presented. Calculation on Ag/Ni interfaces with low-index planes shows that those containing the (111) plane have the lowest energies, which is in agreement with the experiments. Comparing surface energy with interfacial energy, it is found the order of the interfacial energies of Ag/Ni and Cu/Ni containing the planes fall in the same order as solid-vapor surface energies of Ag, Cu and Ni. In this MD simulation, the relaxed atomic structure and dislocation network of (110)(Ag)parallel to(110)(Ni) interface are coincident to HREM observations.
部门归属chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china. northeastern univ, coll sci, shenyang 110004, peoples r china.;wang, sq (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china;sqwang@imr.ac.cn
关键词Molecular Dynamics Interfacial Energy Atomic Structure Heterophase Boundary Fcc Metals Model Boundaries Liquid Nickel
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WOS记录号WOS:000225623300002
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被引频次:7[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/35454
专题中国科学院金属研究所
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H. J. Liu,S. Q. Wang,A. Du,et al. Molecular dynamics study on interfacial energy and atomic structure of Ag/Ni and Cu/Ni heterophase system[J]. Journal of Materials Science & Technology,2004,20(6):644-648.
APA H. J. Liu,S. Q. Wang,A. Du,&C. B. Zhang.(2004).Molecular dynamics study on interfacial energy and atomic structure of Ag/Ni and Cu/Ni heterophase system.Journal of Materials Science & Technology,20(6),644-648.
MLA H. J. Liu,et al."Molecular dynamics study on interfacial energy and atomic structure of Ag/Ni and Cu/Ni heterophase system".Journal of Materials Science & Technology 20.6(2004):644-648.
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