Shear bands in cyclically deformed ultrafine grained copper processed by ECAP

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	Shear bands in cyclically deformed ultrafine grained copper processed by ECAP
	S. D. Wu; Z. G. Wang; C. B. Jiang; G. Y. Li; I. V. Alexandrov; R. Z. Valiev
	2004
发表期刊	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
ISSN	0921-5093
卷号	387 页码:560-564
摘要	Two kinds of shear bands (SBs) which are persistent slip bands (PSB)-like SBs and step-like SBs were found in cyclically deformed ultrafine grained copper processed by ECAP. The SBs and adjacent microstructures were investigated using electron channeling contrast in scanning electron microscope (SEM-ECC). The possible formation mechanisms of SBs are discussed based on the cooperative grain boundary sliding. (C) 2004 Elsevier B.V. All rights reserved.
部门归属	chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china. ufa state aviat tech univ, inst phys adv mat, ufa 450000, russia.;wu, sd (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china;shdwu@imr.ac.cn
关键词	Copper Ecap Ultrafine Grained Microstructures Shear Bands Fatigue
URL	查看原文
WOS记录号	WOS:000226042400117
引用统计	被引频次：56[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/35613
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	S. D. Wu,Z. G. Wang,C. B. Jiang,et al. Shear bands in cyclically deformed ultrafine grained copper processed by ECAP[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2004,387:560-564.
APA	S. D. Wu,Z. G. Wang,C. B. Jiang,G. Y. Li,I. V. Alexandrov,&R. Z. Valiev.(2004).Shear bands in cyclically deformed ultrafine grained copper processed by ECAP.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,387,560-564.
MLA	S. D. Wu,et al."Shear bands in cyclically deformed ultrafine grained copper processed by ECAP".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 387(2004):560-564.